Advanced Polyimide Materials Book

Advanced Polyimide Materials

  • Author : Shi-Yong Yang
  • Publisher : Elsevier
  • Release Date : 2018-04-20
  • Genre: Technology & Engineering
  • Pages : 498
  • ISBN 10 : 9780128126417

Advanced Polyimide Materials Excerpt :

Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. Reviews the latest research, development and future prospective of polyimides Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers Presents a highly organized work that is composed of different sections that are easily compared

Textile Based Advanced Materials Book

Textile Based Advanced Materials

  • Author : Thomas Bechtold
  • Publisher : MDPI
  • Release Date : 2021-03-17
  • Genre: Science
  • Pages : 248
  • ISBN 10 : 9783036504209

Textile Based Advanced Materials Excerpt :

Developments in the science and technology of textiles are not only limited to apparel and fashion. Certainly, there are research efforts aimed at improving the construction and processing of textiles for clothing—such as studies on cleaner production to reduce environmental impact, increasing the utilization of fibers and process chemicals from renewable resources, and on the recycling of materials from post-consumer waste apparel back into the manufacturing of new clothing articles. In addition, technological concepts developed for the creation of clothing over the centuries are now being investigated for use in a diverse array of fields—such as in the manufacture of engineering composites, personal protective equipment, and medicine. Further, developments in other fields—such as electronics, nanotechnology, and information and communication technologies—are being investigated for their incorporation into apparel and clothing to create “smart textiles”. The aim of this Special Issue is to put together a collection of scientific reports on such efforts to highlight the range of scientific and technological issues that are being targeted and the ingenuity of the methodologies employed to find answers. It is hoped that readers of this issue will come away with an appreciation of the research being conducted in this area, and perhaps gain inspiration for their own scientific endeavors.

Polyimide for Electronic and Electrical Engineering Applications Book

Polyimide for Electronic and Electrical Engineering Applications

  • Author : Sombel Diaham
  • Publisher : BoD – Books on Demand
  • Release Date : 2021-05-05
  • Genre: Technology & Engineering
  • Pages : 334
  • ISBN 10 : 9781838800970

Polyimide for Electronic and Electrical Engineering Applications Excerpt :

Polyimide is one of the most efficient polymers in many industries for its excellent thermal, electrical, mechanical, and chemical properties as well as its easy processability. In the electronic and electrical engineering industries, polyimide has widely been used for decades thanks to its very good dielectric and insulating properties at the high electric field and at high temperatures of around 200°C in long term-service. Moreover, polyimide appears essential for the development of new electronic devices where further considerations such as high power density, integration, higher temperature, thermal conduction management, energy storage, reliability, or flexibility are required in order to sustain the growing global electrical energy consumption. This book gathers interdisciplinary chapters on polyimide in various topics through state-of-the-art and original ongoing research.

Emerging Nanoelectronic Devices Book

Emerging Nanoelectronic Devices

  • Author : An Chen
  • Publisher : John Wiley & Sons
  • Release Date : 2014-11-12
  • Genre: Technology & Engineering
  • Pages : 576
  • ISBN 10 : 9781118958261

Emerging Nanoelectronic Devices Excerpt :

Emerging Nanoelectronic Devices focuses on the future direction of semiconductor and emerging nanoscale device technology. As the dimensional scaling of CMOS approaches its limits, alternate information processing devices and microarchitectures are being explored to sustain increasing functionality at decreasing cost into the indefinite future. This is driving new paradigms of information processing enabled by innovative new devices, circuits, and architectures, necessary to support an increasingly interconnected world through a rapidly evolving internet. This original title provides a fresh perspective on emerging research devices in 26 up to date chapters written by the leading researchers in their respective areas. It supplements and extends the work performed by the Emerging Research Devices working group of the International Technology Roadmap for Semiconductors (ITRS). Key features: • Serves as an authoritative tutorial on innovative devices and architectures that populate the dynamic world of “Beyond CMOS” technologies. • Provides a realistic assessment of the strengths, weaknesses and key unknowns associated with each technology. • Suggests guidelines for the directions of future development of each technology. • Emphasizes physical concepts over mathematical development. • Provides an essential resource for students, researchers and practicing engineers.

Carbon Related Materials Book

Carbon Related Materials

  • Author : Camelia Miron
  • Publisher : Springer Nature
  • Release Date : 2020-08-12
  • Genre: Technology & Engineering
  • Pages : 142
  • ISBN 10 : 9783030442309

Carbon Related Materials Excerpt :

This book will give a detailed description of different carbon based materials synthesis methods, characterization, and applications. It serves as a fundamental information source on the actual techniques and methodologies involved in carbon materials synthesis, such as CVD, plasma in liquids, fusion reactors, or frequency-doubled yttrium–aluminum– garnet (YAG) lasers. This book includes coverage of several categories of carbon materials, such as graphene, carbon fiber composites, functionalized carbons, and polyimides used for various applications, from microelectronic industry to slotted waveguide antennas.

Electrical and Electronic Devices  Circuits and Materials Book

Electrical and Electronic Devices Circuits and Materials

  • Author : Suman Lata Tripathi
  • Publisher : CRC Press
  • Release Date : 2021-03-16
  • Genre: Technology & Engineering
  • Pages : 388
  • ISBN 10 : 9781000330090

Electrical and Electronic Devices Circuits and Materials Excerpt :

The increasing demand in home and industry for electronic devices has encouraged designers and researchers to investigate new devices and circuits using new materials that can perform several tasks efficiently with low IC (integrated circuit) area and low power consumption. Furthermore, the increasing demand for portable devices intensifies the search to design sensor elements, an efficient storage cell, and large-capacity memory elements. Electrical and Electronic Devices, Circuits and Materials: Design and Applications will assist the development of basic concepts and fundamentals behind devices, circuits, materials, and systems. This book will allow its readers to develop their understanding of new materials to improve device performance with even smaller dimensions and lower costs. Additionally, this book covers major challenges in MEMS (micro-electromechanical system)-based device and thin-film fabrication and characterization, including their applications in different fields such as sensors, actuators, and biomedical engineering. Key Features: Assists researchers working on devices and circuits to correlate their work with other requirements of advanced electronic systems. Offers guidance for application-oriented electrical and electronic device and circuit design for future energy-efficient systems. Encourages awareness of the international standards for electrical and electronic device and circuit design. Organized into 23 chapters, Electrical and Electronic Devices, Circuits and Materials: Design and Applications will create a foundation to generate new electrical and electronic devices and their applications. It will be of vital significance for students and researchers seeking to establish the key parameters for future work.

Polymer Based Advanced Functional Composites for Optoelectronic and Energy Applications Book

Polymer Based Advanced Functional Composites for Optoelectronic and Energy Applications

  • Author : Nithin Kundachira Subramani
  • Publisher : Elsevier
  • Release Date : 2021-05-28
  • Genre: Technology & Engineering
  • Pages : 374
  • ISBN 10 : 9780128185094

Polymer Based Advanced Functional Composites for Optoelectronic and Energy Applications Excerpt :

Polymer-Based Advanced Functional Composites for Optoelectronic and Energy Applications explains how polymer-based smart composites and nanocomposites can be prepared and utilized for novel optical, sensor and energy-related applications. The book begins with an introductory section on the fundamentals of smart polymer composites, including structure-property relationships and conjugated polymers. Other sections examine optical applications, including the use of polymer-based smart composites for luminescent solar concentrators, electro-chromic applications, light conversion applications, ultraviolet shielding applications, LED encapsulation applications, sensor applications, including gas-sensing, strain sensing, robotics and tactile sensors, with final sections covering energy-related applications, including energy harvesting, conversion, storage, vibrational energy harvesting, and more. This is an essential guide for researchers, scientists and advanced students in smart polymers and materials, polymer science, composites, nanocomposites, electronics and materials science. It is also a valuable book for scientists, R&D professionals and engineers working with products that could utilize smart polymer composites. Provides thorough coverage of the latest pioneering research in the field of polymer-based smart composites Offers an applications-oriented approach, enabling the reader to understand state-of-the-art optical, sensor and energy applications Includes an in-depth introductory section, covering important aspects such as structure-property relationships and the role of conjugated polymers

Advanced Polymers   A Gateway to Research   Industries Book

Advanced Polymers A Gateway to Research Industries

  • Author : Dr. K.S. Lakshmi
  • Publisher : Allied Publishers
  • Release Date : 2017-07-21
  • Genre: Science
  • Pages : 80
  • ISBN 10 : 9789385926655

Advanced Polymers A Gateway to Research Industries Excerpt :

Book of Abstracts The seminar was organized to emphasize the role and applications of "Advanced polymers" in meeting the demands of researchers and industrialists, by providing a platform for discussions among the polymer scientists, engineers, technologists, industrialists and academicians across the country, and educating students and budding scientists to equip them in order to cater to the needs of industries.

Memristor and Memristive Neural Networks Book

Memristor and Memristive Neural Networks

  • Author : Alex James
  • Publisher : BoD – Books on Demand
  • Release Date : 2018-04-04
  • Genre: Computers
  • Pages : 324
  • ISBN 10 : 9789535139478

Memristor and Memristive Neural Networks Excerpt :

This book covers a range of models, circuits and systems built with memristor devices and networks in applications to neural networks. It is divided into three parts: (1) Devices, (2) Models and (3) Applications. The resistive switching property is an important aspect of the memristors, and there are several designs of this discussed in this book, such as in metal oxide/organic semiconductor nonvolatile memories, nanoscale switching and degradation of resistive random access memory and graphene oxide-based memristor. The modelling of the memristors is required to ensure that the devices can be put to use and improve emerging application. In this book, various memristor models are discussed, from a mathematical framework to implementations in SPICE and verilog, that will be useful for the practitioners and researchers to get a grounding on the topic. The applications of the memristor models in various neuromorphic networks are discussed covering various neural network models, implementations in A/D converter and hierarchical temporal memories.

Issues in Structural and Materials Engineering  2011 Edition Book

Issues in Structural and Materials Engineering 2011 Edition

  • Author : Anonim
  • Publisher : ScholarlyEditions
  • Release Date : 2012-01-09
  • Genre: Technology & Engineering
  • Pages : 1920
  • ISBN 10 : 9781464963964

Issues in Structural and Materials Engineering 2011 Edition Excerpt :

Issues in Structural and Materials Engineering: 2011 Edition is a ScholarlyEditions™ eBook that delivers timely, authoritative, and comprehensive information about Structural and Materials Engineering. The editors have built Issues in Structural and Materials Engineering: 2011 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Structural and Materials Engineering in this eBook to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Issues in Structural and Materials Engineering: 2011 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at

Polymer Composites for Electrical Engineering Book

Polymer Composites for Electrical Engineering

  • Author : Xingyi Huang
  • Publisher : John Wiley & Sons
  • Release Date : 2021-10-27
  • Genre: Technology & Engineering
  • Pages : 448
  • ISBN 10 : 9781119719656

Polymer Composites for Electrical Engineering Excerpt :

Explore the diverse electrical engineering application of polymer composite materials with this in-depth collection edited by leaders in the field Polymer Composites for Electrical Engineering delivers a comprehensive exploration of the fundamental principles, state-of-the-art research, and future challenges of polymer composites. Written from the perspective of electrical engineering applications, like electrical and thermal energy storage, high temperature applications, fire retardance, power cables, electric stress control, and others, the book covers all major application branches of these widely used materials. Rather than focus on polymer composite materials themselves, the distinguished editors have chosen to collect contributions from industry leaders in the area of real and practical electrical engineering applications of polymer composites. The book's relevance will only increase as advanced polymer composites receive more attention and interest in the area of advanced electronic devices and electric power equipment. Unique amongst its peers, Polymer Composites for Electrical Engineering offers readers a collection of practical and insightful materials that will be of great interest to both academic and industrial audiences. Those resources include: A comprehensive discussion of glass fiber reinforced polymer composites for power equipment, including GIS, bushing, transformers, and more) Explorations of polymer composites for capacitors, outdoor insulation, electric stress control, power cable insulation, electrical and thermal energy storage, and high temperature applications A treatment of semi-conductive polymer composites for power cables In-depth analysis of fire-retardant polymer composites for electrical engineering An examination of polymer composite conductors Perfect for postgraduate students and researchers working in the fields of electrical, electronic, and polymer engineering, Polymer Composites for Electrical Engineering will also earn a pla

NASA Tech Briefs Book

NASA Tech Briefs

  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 2000
  • Genre: Technology
  • Pages : null
  • ISBN 10 : STANFORD:36105028839780

NASA Tech Briefs Excerpt :

Soft Material Enabled Electronics for Medicine  Healthcare  and Human Machine Interfaces Book

Soft Material Enabled Electronics for Medicine Healthcare and Human Machine Interfaces

  • Author : Jae-Woong Jeong
  • Publisher : MDPI
  • Release Date : 2020-03-13
  • Genre: Technology & Engineering
  • Pages : 244
  • ISBN 10 : 9783039282821

Soft Material Enabled Electronics for Medicine Healthcare and Human Machine Interfaces Excerpt :

Soft material-enabled electronics offer distinct advantage, over conventional rigid and bulky devices, for numerous wearable and implantable applications. Soft materials allow for seamless integration with skin and tissues due to enhanced mechanical flexibility and stretchability. Wearable devices, such as sensors, offer continuous, real-time monitoring of biosignals and movements, which can be applied in rehabilitation and diagnostics, among other applications. Soft implantable electronics offer similar functionalities, but with improved compatibility with human tissues. Biodegradable soft implantable electronics are also being developed for transient monitoring, such as in the weeks following surgery. To further advance soft electronics, materials, integration strategies, and fabrication techniques are being developed. This paper reviews recent progress in these areas, toward the development of soft material-enabled electronics for medicine, healthcare, and human-machine interfaces.

Advances in Embedded and Fan Out Wafer Level Packaging Technologies Book

Advances in Embedded and Fan Out Wafer Level Packaging Technologies

  • Author : Beth Keser
  • Publisher : Wiley-IEEE Press
  • Release Date : 2019-02-20
  • Genre: Technology & Engineering
  • Pages : 528
  • ISBN 10 : 9781119314134

Advances in Embedded and Fan Out Wafer Level Packaging Technologies Excerpt :

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field’s leading experts, Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.