Advances in Chemical Mechanical Planarization  CMP  Book

Advances in Chemical Mechanical Planarization CMP


  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release Date : 2021-09-24
  • Genre: Technology & Engineering
  • Pages : 648
  • ISBN 10 : 9780128218198

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Advances in Chemical Mechanical Planarization CMP Excerpt :

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Advances in Chemical Mechanical Planarization  Cmp  Book

Advances in Chemical Mechanical Planarization Cmp


  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing Limited
  • Release Date : 2016-01-12
  • Genre: Uncategoriezed
  • Pages : 810
  • ISBN 10 : 0081001657

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Advances in Chemical Mechanical Planarization Cmp Excerpt :

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP

Advances in CMP Polishing Technologies Book

Advances in CMP Polishing Technologies


  • Author : Toshiro Doi
  • Publisher : William Andrew
  • Release Date : 2011-12-06
  • Genre: Science
  • Pages : 330
  • ISBN 10 : 9781437778595

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Advances in CMP Polishing Technologies Excerpt :

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Chemical Mechanical Planarization of Microelectronic Materials Book

Chemical Mechanical Planarization of Microelectronic Materials


  • Author : Joseph M. Steigerwald
  • Publisher : John Wiley & Sons
  • Release Date : 2008-09-26
  • Genre: Science
  • Pages : 337
  • ISBN 10 : 9783527617753

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Chemical Mechanical Planarization of Microelectronic Materials Excerpt :

Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to

Abrasive Technology Book

Abrasive Technology


  • Author : Anna Rudawska
  • Publisher : BoD – Books on Demand
  • Release Date : 2018-10-24
  • Genre: Technology & Engineering
  • Pages : 214
  • ISBN 10 : 9781789841930

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Abrasive Technology Excerpt :

The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics and applications of abrasive technology, abrasive tools, tests, and also the innovative methods of this technology. This information enables scientists, engineers, and designers to ensure the soundness and integrity of the fabricated components and to develop new techniques effectively.

Emerging Contaminants Book

Emerging Contaminants


  • Author : Aurel Nuro
  • Publisher : BoD – Books on Demand
  • Release Date : 2021-05-27
  • Genre: Science
  • Pages : 334
  • ISBN 10 : 9781839624186

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Emerging Contaminants Excerpt :

Emerging Contaminants presents the reader with information on classification, recent studies, and adverse effects on the environment and human health of the main classes of contaminants. Emerging contaminants are synthetic or natural compounds and microorganisms produced and used by humans that cause adverse ecological and human health effects when they reach the environment. This book is organized into four sections that cover the classification of contaminants and the instrumental techniques used to quantify them, recent studies on pesticides, antibiotics as an important group of emerging contaminants, and studies of different classes of emerging contaminants such as polybrominated diphenyl ethers (PBDEs), microplastics, and others.

Chemical Mechanical Planarization of Semiconductor Materials Book

Chemical Mechanical Planarization of Semiconductor Materials


  • Author : M.R. Oliver
  • Publisher : Springer Science & Business Media
  • Release Date : 2004-01-26
  • Genre: Technology & Engineering
  • Pages : 444
  • ISBN 10 : 3540431810

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Chemical Mechanical Planarization of Semiconductor Materials Excerpt :

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

MEMS Materials and Processes Handbook Book
Score: 4
From 1 Ratings

MEMS Materials and Processes Handbook


  • Author : Reza Ghodssi
  • Publisher : Springer Science & Business Media
  • Release Date : 2011-03-18
  • Genre: Technology & Engineering
  • Pages : 1188
  • ISBN 10 : 9780387473185

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MEMS Materials and Processes Handbook Excerpt :

MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.

Wafer Manufacturing Book

Wafer Manufacturing


  • Author : Imin Kao
  • Publisher : John Wiley & Sons
  • Release Date : 2021-01-11
  • Genre: Technology & Engineering
  • Pages : 304
  • ISBN 10 : 9780470061213

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Wafer Manufacturing Excerpt :

Presenting all the major stages in wafer manufacturing, from crystals to prime wafers. This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques. The whole is rounded off with a chapter on the research and future challenges in wafer manufacturing.

Eco Friendly Corrosion Inhibitors Book

Eco Friendly Corrosion Inhibitors


  • Author : Lei Guo
  • Publisher : Elsevier
  • Release Date : 2022-07-08
  • Genre: Science
  • Pages : 576
  • ISBN 10 : 9780323998420

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Eco Friendly Corrosion Inhibitors Excerpt :

Eco-Friendly Corrosion Inhibitors: Principles, Designing, and Applications wraps up new developments in corrosion inhibitors and their current applications in real-life environments such as in strong acidic pickling and petroleum-based liquids. The book covers several types of environmentally-friendly corrosion inhibitors in detail. In addition, it highlights both established research and technology on industrial scale corrosion inhibitors and their rapidly emerging aspects and future research directions. Provides fundamental basics and applied practices of corrosion prevention at industrial scale Serves as a valuable reference for scientists and engineers who are searching modern design for industrial scale corrosion inhibitors Focuses on the most advanced industrial scale corrosion inhibitors, including current challenges during manufacturing Includes up-to-date reference material such as websites of interest and information about the latest research

Tribology In Chemical Mechanical Planarization Book

Tribology In Chemical Mechanical Planarization


  • Author : Hong Liang
  • Publisher : CRC Press
  • Release Date : 2005-03-01
  • Genre: Technology & Engineering
  • Pages : 200
  • ISBN 10 : 9781420028393

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Tribology In Chemical Mechanical Planarization Excerpt :

The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for tribology professionals as well as chemists, materials scientists, physicists, and other applied scientists and engineers in fields of semiconductors and microelectronics. The first half of the book is devoted to CMP, while the other focuses on the fundamentals of tribology. As the first source to integrate CMP and tribology, the book illustrates the important role that these fields play in manufacturing and technological development. It follows with an examination of tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects. Other topics covered in depth include basics of friction, flash temperature, lubrication fundamentals, basics of wear, polishing particles, and pad wear. The book concludes its focus with CMP practices, discussing mechanical aspects, pad materials, elastic modulus, and cell buckling. Expanding upon the science and technology of tribology to improve the reliability, maintenance, and wear of technical equipment and other material applications, Tribology in Chemical-Mechanical Planarization provides scientists and engineers with clear foresight to the future of this technology.

Advanced Interconnects for ULSI Technology Book

Advanced Interconnects for ULSI Technology


  • Author : Mikhail Baklanov
  • Publisher : John Wiley & Sons
  • Release Date : 2012-02-17
  • Genre: Technology & Engineering
  • Pages : 624
  • ISBN 10 : 9781119966869

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Advanced Interconnects for ULSI Technology Excerpt :

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Handbook of Semiconductor Interconnection Technology Book

Handbook of Semiconductor Interconnection Technology


  • Author : Geraldine Cogin Shwartz
  • Publisher : CRC Press
  • Release Date : 1997-11-24
  • Genre: Technology & Engineering
  • Pages : 598
  • ISBN 10 : 0849384664

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Handbook of Semiconductor Interconnection Technology Excerpt :

Covering materials, processes, equipment, methodologies, characterization techniques, clean room practices, and ways to control contamination-related defects, this work offers up-to-date information on the application of interconnection technology to semiconductors. It offers an integration of technical, patent and industry literature.

Advances in Tribology Book

Advances in Tribology


  • Author : Pranav H. Darji
  • Publisher : Unknown
  • Release Date : 2016-10-26
  • Genre: Uncategoriezed
  • Pages : 280
  • ISBN 10 : 9789535127420

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Advances in Tribology Excerpt :

Algorithms for VLSI Physical Design Automation Book

Algorithms for VLSI Physical Design Automation


  • Author : Naveed A. Sherwani
  • Publisher : Springer Science & Business Media
  • Release Date : 2012-12-06
  • Genre: Technology & Engineering
  • Pages : 538
  • ISBN 10 : 9781461523512

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Algorithms for VLSI Physical Design Automation Excerpt :

Algorithms for VLSI Physical Design Automation, Second Edition is a core reference text for graduate students and CAD professionals. Based on the very successful First Edition, it provides a comprehensive treatment of the principles and algorithms of VLSI physical design, presenting the concepts and algorithms in an intuitive manner. Each chapter contains 3-4 algorithms that are discussed in detail. Additional algorithms are presented in a somewhat shorter format. References to advanced algorithms are presented at the end of each chapter. Algorithms for VLSI Physical Design Automation covers all aspects of physical design. In 1992, when the First Edition was published, the largest available microprocessor had one million transistors and was fabricated using three metal layers. Now we process with six metal layers, fabricating 15 million transistors on a chip. Designs are moving to the 500-700 MHz frequency goal. These stunning developments have significantly altered the VLSI field: over-the-cell routing and early floorplanning have come to occupy a central place in the physical design flow. This Second Edition introduces a realistic picture to the reader, exposing the concerns facing the VLSI industry, while maintaining the theoretical flavor of the First Edition. New material has been added to all chapters, new sections have been added to most chapters, and a few chapters have been completely rewritten. The textual material is supplemented and clarified by many helpful figures. Audience: An invaluable reference for professionals in layout, design automation and physical design.