Chip Technology Book

Chip Technology


  • Author : Jörg Hoheisel
  • Publisher : Springer
  • Release Date : 2003-07-01
  • Genre: Science
  • Pages : 156
  • ISBN 10 : 9783540457138

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Chip Technology Excerpt :

DNA-chip analysis has come a long way since the first conference in Moscow in 1991. Nowadays, DNA-microarrays seem to be a common commodity in biological sciences. The complexity hidden behind the apparent ease of such studies, however, is highlighted by the fact that it took about ten years before the methodology really set off. Also, on closer scrutiny, one realises that some problems still remain. Nevertheless, microarrays produce data on a scale beyond imagination a few years ago. The authors of the book took part in bringing this about. They are well-known experts in the field, many - like Edwin Southern, Hans Lehrach, Radoje Drmanac, Pavel Pevzner and Charles Cantor - have been actively pursuing array technology for more than a decade. They demonstrate the continuous development in both technology and application areas and elucidate on critical points that need to be considered when performing microarray analyses.

On chip Pretreatment of Whole Blood by Using MEMS Technology Book

On chip Pretreatment of Whole Blood by Using MEMS Technology


  • Author : Xing Chen
  • Publisher : Bentham Science Publishers
  • Release Date : 2012
  • Genre: Technology & Engineering
  • Pages : 118
  • ISBN 10 : 9781608051472

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On chip Pretreatment of Whole Blood by Using MEMS Technology Excerpt :

Microfabrication technology has stimulated a plurality of lab-on-a-chip research and development efforts aimed at enabling biomedical researchers and health care practitioners to manipulate and analyze complex biological fluids at the nano and microliter

Ultra thin Chip Technology and Applications Book

Ultra thin Chip Technology and Applications


  • Author : Joachim Burghartz
  • Publisher : Springer Science & Business Media
  • Release Date : 2010-11-18
  • Genre: Technology & Engineering
  • Pages : 467
  • ISBN 10 : 9781441972767

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Ultra thin Chip Technology and Applications Excerpt :

Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.

Labs on Chip Book

Labs on Chip


  • Author : Eugenio Iannone
  • Publisher : CRC Press
  • Release Date : 2018-09-03
  • Genre: Medical
  • Pages : 1178
  • ISBN 10 : 9781466560734

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Labs on Chip Excerpt :

Labs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas— fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistry—this text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design and Technology offers valuable guidance for the lab-on-chip design decision-making process, while exploring essential elements of labs on chip useful both to the professional who wants to approach a new field and to the specialist who wants to gain a broader perspective.

Micro Nanofluidics and Lab on Chip Based Emerging Technologies for Biomedical and Translational Research Applications   Part B Book

Micro Nanofluidics and Lab on Chip Based Emerging Technologies for Biomedical and Translational Research Applications Part B


  • Author : Anonim
  • Publisher : Academic Press
  • Release Date : 2022-02-01
  • Genre: Science
  • Pages : 368
  • ISBN 10 : 9780323853040

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Micro Nanofluidics and Lab on Chip Based Emerging Technologies for Biomedical and Translational Research Applications Part B Excerpt :

Micro/Nanofluidics and Lab-on-Chip Based Emerging Technologies for Biomedical and Translational Research Applications - Part B, Volume 187 represents the collation of chapters written by eminent scientists worldwide. Chapters in this new release include Design and fabrication of microfluidics devices for molecular biology applications, Micro/Nanofluidics devices for drug delivery, From organ-on-chip to body-on-chip: the next generation of microfluidics platforms for in vitro drug toxicity testing, Micro/Nanofluidics for high throughput drug screening, Design, fabrication and assembly of lab-on-a-chip and its uses, Advances in microfluidic 3D cell culture for pre-clinical drug development, Tissue and organ culture on lab-on-a chip for biomedical applications, and much more. Offers a basic understanding of the state-of-the-art design and fabrication of microfluidics/ nanofluidics and lab on chip Explains how to develop microfluidics/nanofluidic for advanced application such as healthcare, high throughout drug screening, 3D cell culture and organ-on-chip Discusses the emerging demands and research of micro/nanofluidic based devices in biomedical and translational research applications

Chip On Board Book

Chip On Board


  • Author : John H. Lau
  • Publisher : Springer Science & Business Media
  • Release Date : 1994-06-30
  • Genre: Computers
  • Pages : 556
  • ISBN 10 : 0442014414

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Chip On Board Excerpt :

This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.

The East Asian Computer Chip War Book

The East Asian Computer Chip War


  • Author : Ming-chin Monique Chu
  • Publisher : Routledge
  • Release Date : 2013-12-04
  • Genre: Political Science
  • Pages : 336
  • ISBN 10 : 9781317961567

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The East Asian Computer Chip War Excerpt :

The semiconductor industry is a vital industry for military establishments worldwide, and the control of, or loss of control of, this key industry has enormous strategic implications. This book focuses on the globalization of the strategic semiconductor industry and the security ramifications of this process. It examines in particular the migration of the Taiwanese chip industry to China as part of the globalization of production processes, and the extent to which such a globalization process poses security challenges to the United States, China and Taiwan. Transcending disciplinary boundaries between international political economy, security studies, and the history of science and technology, this multidisciplinary work provides an in-depth understanding of the globalization-security nexus, and disentangles the key policy issues connected to a potential explosive flashpoint in world politics today.

Living with the Chip Book

Living with the Chip


  • Author : D. Manners
  • Publisher : Springer Science & Business Media
  • Release Date : 1995
  • Genre: Computers
  • Pages : 204
  • ISBN 10 : 0412616904

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Living with the Chip Excerpt :

Seeking to bridge the gap between the microelectronics community and the general public, this book explains the evolution of the technology with its social and economic effects, shows the forces shaping the industry and concludes with a glimpse of the ideas currently under development in the world's electronics laboratories.

Handbook of VLSI Chip Design and Expert Systems Book

Handbook of VLSI Chip Design and Expert Systems


  • Author : A. F. Schwarz
  • Publisher : Academic Press
  • Release Date : 2014-05-10
  • Genre: Technology & Engineering
  • Pages : 590
  • ISBN 10 : 9781483258058

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Handbook of VLSI Chip Design and Expert Systems Excerpt :

Handbook of VLSI Chip Design and Expert Systems provides information pertinent to the fundamental aspects of expert systems, which provides a knowledge-based approach to problem solving. This book discusses the use of expert systems in every possible subtask of VLSI chip design as well as in the interrelations between the subtasks. Organized into nine chapters, this book begins with an overview of design automation, which can be identified as Computer-Aided Design of Circuits and Systems (CADCAS). This text then presents the progress in artificial intelligence, with emphasis on expert systems. Other chapters consider the impact of design automation, which exploits the basic capabilities of computers to perform complex calculations and to handle huge amounts of data with a high speed and accuracy. This book discusses as well the characterization of microprocessors. The final chapter deals with interactive I/O devices. This book is a valuable resource for system design experts, circuit analysts and designers, logic designers, device engineers, technologists, and application-specific designers.

Advanced Flip Chip Packaging Book

Advanced Flip Chip Packaging


  • Author : Ho-Ming Tong
  • Publisher : Springer Science & Business Media
  • Release Date : 2013-03-20
  • Genre: Technology & Engineering
  • Pages : 560
  • ISBN 10 : 9781441957689

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Advanced Flip Chip Packaging Excerpt :

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Advances in Embedded and Fan Out Wafer Level Packaging Technologies Book

Advances in Embedded and Fan Out Wafer Level Packaging Technologies


  • Author : Beth Keser
  • Publisher : Wiley-IEEE Press
  • Release Date : 2019-02-20
  • Genre: Technology & Engineering
  • Pages : 528
  • ISBN 10 : 9781119314134

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Advances in Embedded and Fan Out Wafer Level Packaging Technologies Excerpt :

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field’s leading experts, Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.

Multi Chip Module Test Strategies Book

Multi Chip Module Test Strategies


  • Author : Yervant Zorian
  • Publisher : Springer Science & Business Media
  • Release Date : 2012-12-06
  • Genre: Technology & Engineering
  • Pages : 167
  • ISBN 10 : 9781461561071

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Multi Chip Module Test Strategies Excerpt :

MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).

Lab on a chip Book

Lab on a chip


  • Author : Yehya H. Ghallab
  • Publisher : Artech House
  • Release Date : 2010
  • Genre: Biomedical engineering
  • Pages : 220
  • ISBN 10 : 9781596934191

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Lab on a chip Excerpt :

HereOCOs a groundbreaking book that introduces and discusses the important aspects of lab-on-a-chip, including the practical techniques, circuits, microsystems, and key applications in the biomedical, biology, and life science fields. Moreover, this volume covers ongoing research in lab-on-a-chip integration and electric field imaging. Presented in a clear and logical manner, the book provides you with the fundamental underpinnings of lab-on-a-chip, presents practical results, and brings you up to date with state-of-the-art research in the field. This unique resource is supported with over 160 illustrations that clarify important topics throughout.