CMOS Past  Present and Future Book

CMOS Past Present and Future

  • Author : Henry Radamson
  • Publisher : Woodhead Publishing
  • Release Date : 2018-04-03
  • Genre: Technology & Engineering
  • Pages : 278
  • ISBN 10 : 9780081021408

CMOS Past Present and Future Excerpt :

CMOS Past, Present and Future provides insight from the basics, to the state-of-the-art of CMOS processing and electrical characterization, including the integration of Group IV semiconductors-based photonics. The book goes into the pitfalls and opportunities associated with the use of hetero-epitaxy on silicon with strain engineering and the integration of photonics and high-mobility channels on a silicon platform. It begins with the basic definitions and equations, but extends to present technologies and challenges, creating a roadmap on the origins of the technology and its evolution to the present, along with a vision for future trends. The book examines the challenges and opportunities that materials beyond silicon provide, including a close look at high-k materials and metal gate, strain engineering, channel material and mobility, and contacts. The book's key approach is on characterizations, device processing and electrical measurements. Addresses challenges and opportunities for the use of CMOS Covers the latest methods of strain engineering, materials integration to increase mobility, nano-scaled transistor processing, and integration of CMOS with photonic components Provides a look at the evolution of CMOS technology, including the origins of the technology, current status and future possibilities

Securitization  Past  Present and Future Book

Securitization Past Present and Future

  • Author : Solomon Y Deku
  • Publisher : Springer
  • Release Date : 2017-08-04
  • Genre: Business & Economics
  • Pages : 177
  • ISBN 10 : 9783319601281

Securitization Past Present and Future Excerpt :

This book aims to explore if and how securitization changed financial intermediation and lending behaviour by reviewing the pre- and post-financial crisis theoretical and empirical literature. The book’s distinctive feature is bringing the growing post-crisis empirical evidence to the attention of a wider audience by critically appraising it against pre-crisis arguments. With its thought-provoking insights, this book is of particular interest for students, practitioners and academics.

SiGe  Ge  and Related Compounds 4  Materials  Processing  and Devices Book

SiGe Ge and Related Compounds 4 Materials Processing and Devices

  • Author : D. Harame
  • Publisher : The Electrochemical Society
  • Release Date : 2010-10
  • Genre: Germanium compounds
  • Pages : 1034
  • ISBN 10 : 9781566778251

SiGe Ge and Related Compounds 4 Materials Processing and Devices Excerpt :

Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds has become a key component in the arsenal in improving semiconductor performance. This symposium discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.

FinFET Devices for VLSI Circuits and Systems Book

FinFET Devices for VLSI Circuits and Systems

  • Author : Samar K. Saha
  • Publisher : CRC Press
  • Release Date : 2020-07-15
  • Genre: Technology & Engineering
  • Pages : 318
  • ISBN 10 : 9780429998096

FinFET Devices for VLSI Circuits and Systems Excerpt :

To surmount the continuous scaling challenges of MOSFET devices, FinFETs have emerged as the real alternative for use as the next generation device for IC fabrication technology. The objective of this book is to provide the basic theory and operating principles of FinFET devices and technology, an overview of FinFET device architecture and manufacturing processes, and detailed formulation of FinFET electrostatic and dynamic device characteristics for IC design and manufacturing. Thus, this book caters to practicing engineers transitioning to FinFET technology and prepares the next generation of device engineers and academic experts on mainstream device technology at the nanometer-nodes.

Photonics and Electronics with Germanium Book

Photonics and Electronics with Germanium

  • Author : Kazumi Wada
  • Publisher : John Wiley & Sons
  • Release Date : 2015-05-06
  • Genre: Science
  • Pages : 336
  • ISBN 10 : 9783527650224

Photonics and Electronics with Germanium Excerpt :

Representing a further step towards enabling the convergence of computing and communication, this handbook and reference treats germanium electronics and optics on an equal footing. Renowned experts paint the big picture, combining both introductory material and the latest results. The first part of the book introduces readers to the fundamental properties of germanium, such as band offsets, impurities, defects and surface structures, which determine the performance of germanium-based devices in conjunction with conventional silicon technology. The second part covers methods of preparing and processing germanium structures, including chemical and physical vapor deposition, condensation approaches and chemical etching. The third and largest part gives a broad overview of the applications of integrated germanium technology: waveguides, photodetectors, modulators, ring resonators, transistors and, prominently, light-emitting devices. An invaluable one-stop resource for both researchers and developers.

Fundamentals of Photonics Book

Fundamentals of Photonics

  • Author : Bahaa E. A. Saleh
  • Publisher : John Wiley & Sons
  • Release Date : 2019-02-27
  • Genre: Technology & Engineering
  • Pages : 1520
  • ISBN 10 : 9781118770092

Fundamentals of Photonics Excerpt :

Fundamentals of Photonics A complete, thoroughly updated, full-color third edition Fundamentals of Photonics, Third Edition is a self-contained and up-to-date introductory-level textbook that thoroughly surveys this rapidly expanding area of engineering and applied physics. Featuring a blend of theory and applications, coverage includes detailed accounts of the primary theories of light, including ray optics, wave optics, electromagnetic optics, and photon optics, as well as the interaction of light and matter. Presented at increasing levels of complexity, preliminary sections build toward more advanced topics, such as Fourier optics and holography, photonic-crystal optics, guided-wave and fiber optics, LEDs and lasers, acousto-optic and electro-optic devices, nonlinear optical devices, ultrafast optics, optical interconnects and switches, and optical fiber communications. The third edition features an entirely new chapter on the optics of metals and plasmonic devices. Each chapter contains highlighted equations, exercises, problems, summaries, and selected reading lists. Examples of real systems are included to emphasize the concepts governing applications of current interest. Each of the twenty-four chapters of the second edition has been thoroughly updated.

Stress and Strain Engineering at Nanoscale in Semiconductor Devices Book

Stress and Strain Engineering at Nanoscale in Semiconductor Devices

  • Author : Chinmay K. Maiti
  • Publisher : CRC Press
  • Release Date : 2021-06-30
  • Genre: Science
  • Pages : 274
  • ISBN 10 : 9781000404937

Stress and Strain Engineering at Nanoscale in Semiconductor Devices Excerpt :

Anticipating a limit to the continuous miniaturization (More-Moore), intense research efforts are being made to co-integrate various functionalities (More-than-Moore) in a single chip. Currently, strain engineering is the main technique used to enhance the performance of advanced semiconductor devices. Written from an engineering applications standpoint, this book encompasses broad areas of semiconductor devices involving the design, simulation, and analysis of Si, heterostructure silicongermanium (SiGe), and III-N compound semiconductor devices. The book provides the background and physical insight needed to understand the new and future developments in the technology CAD (TCAD) design at the nanoscale. Features Covers stressstrain engineering in semiconductor devices, such as FinFETs and III-V Nitride-based devices Includes comprehensive mobility model for strained substrates in global and local strain techniques and their implementation in device simulations Explains the development of strain/stress relationships and their effects on the band structures of strained substrates Uses design of experiments to find the optimum process conditions Illustrates the use of TCAD for modeling strain-engineered FinFETs for DC and AC performance predictions This book is for graduate students and researchers studying solid-state devices and materials, microelectronics, systems and controls, power electronics, nanomaterials, and electronic materials and devices.

On Wafer Microwave Measurements and De embedding Book

On Wafer Microwave Measurements and De embedding

  • Author : Errikos Lourandakis
  • Publisher : Artech House
  • Release Date : 2016-07-31
  • Genre: Technology & Engineering
  • Pages : 256
  • ISBN 10 : 9781630813710

On Wafer Microwave Measurements and De embedding Excerpt :

This new authoritative resource presents the basics of network analyzer measurement equipment and troubleshooting errors involved in the on-wafer microwave measurement process. This book bridges the gap between theoretical and practical information using real-world practices that address all aspects of on-wafer passive device characterization in the microwave frequency range up to 60GHz. Readers find data and measurements from silicon integrated passive devices fabricated and tested in advance CMOS technologies. Basic circuit equations, terms and fundamentals of time and frequency domain analysis are covered. This book also explores the basics of vector network analyzers (VNA), two port S-parameter measurement routines, signal flow graphs, network theory, error models and VNA calibrations with the use of calibration standards.

Silicon Photonics Book

Silicon Photonics

  • Author : Graham T. Reed
  • Publisher : John Wiley & Sons
  • Release Date : 2008-05-23
  • Genre: Technology & Engineering
  • Pages : 354
  • ISBN 10 : 9780470994528

Silicon Photonics Excerpt :

Silicon photonics is currently a very active and progressive area of research, as silicon optical circuits have emerged as the replacement technology for copper-based circuits in communication and broadband networks. The demand for ever improving communications and computing performance continues, and this in turn means that photonic circuits are finding ever increasing application areas. This text provides an important and timely overview of the ‘hot topics’ in the field, covering the various aspects of the technology that form the research area of silicon photonics. With contributions from some of the world’s leading researchers in silicon photonics, this book collates the latest advances in the technology. Silicon Photonics: the State of the Art opens with a highly informative foreword, and continues to feature: the integrated photonic circuit; silicon photonic waveguides; photonic bandgap waveguides; mechanisms for optical modulation in silicon; silicon based light sources; optical detection technologies for silicon photonics; passive silicon photonic devices; photonic and electronic integration approaches; applications in communications and sensors. Silicon Photonics: the State of the Art covers the essential elements of the entire field that is silicon photonics and is therefore an invaluable text for photonics engineers and professionals working in the fields of optical networks, optical communications, and semiconductor electronics. It is also an informative reference for graduate students studying for PhD in fibre optics, integrated optics, optical networking, microelectronics, or telecommunications.

Encyclopedia of Automotive Engineering Book
Score: 5
From 1 Ratings

Encyclopedia of Automotive Engineering

  • Author : David A. Crolla
  • Publisher : John Wiley & Sons
  • Release Date : 2015
  • Genre: Automobiles
  • Pages : 607
  • ISBN 10 : 9780470974025

Encyclopedia of Automotive Engineering Excerpt :

3D and Circuit Integration of MEMS Book

3D and Circuit Integration of MEMS

  • Author : Masayoshi Esashi
  • Publisher : John Wiley & Sons
  • Release Date : 2021-03-16
  • Genre: Technology & Engineering
  • Pages : 528
  • ISBN 10 : 9783527823253

3D and Circuit Integration of MEMS Excerpt :

Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.

Silicon Heterostructure Handbook Book

Silicon Heterostructure Handbook

  • Author : John D. Cressler
  • Publisher : CRC Press
  • Release Date : 2018-10-03
  • Genre: Technology & Engineering
  • Pages : 1248
  • ISBN 10 : 9781420026580

Silicon Heterostructure Handbook Excerpt :

An extraordinary combination of material science, manufacturing processes, and innovative thinking spurred the development of SiGe heterojunction devices that offer a wide array of functions, unprecedented levels of performance, and low manufacturing costs. While there are many books on specific aspects of Si heterostructures, the Silicon Heterostructure Handbook: Materials, Fabrication, Devices, Circuits, and Applications of SiGe and Si Strained-Layer Epitaxy is the first book to bring all aspects together in a single source. Featuring broad, comprehensive, and in-depth discussion, this handbook distills the current state of the field in areas ranging from materials to fabrication, devices, CAD, circuits, and applications. The editor includes "snapshots" of the industrial state-of-the-art for devices and circuits, presenting a novel perspective for comparing the present status with future directions in the field. With each chapter contributed by expert authors from leading industrial and research institutions worldwide, the book is unequalled not only in breadth of scope, but also in depth of coverage, timeliness of results, and authority of references. It also includes a foreword by Dr. Bernard S. Meyerson, a pioneer in SiGe technology. Containing nearly 1000 figures along with valuable appendices, the Silicon Heterostructure Handbook authoritatively surveys materials, fabrication, device physics, transistor optimization, optoelectronics components, measurement, compact modeling, circuit design, and device simulation.

Istfa 2005 Book
Score: 5
From 1 Ratings

Istfa 2005

  • Author : ASM International
  • Publisher : ASM International
  • Release Date : 2005-01-01
  • Genre: Technology & Engineering
  • Pages : 524
  • ISBN 10 : 9781615030880

Istfa 2005 Excerpt :

SiGe and Si Strained Layer Epitaxy for Silicon Heterostructure Devices Book

SiGe and Si Strained Layer Epitaxy for Silicon Heterostructure Devices

  • Author : John D. Cressler
  • Publisher : CRC Press
  • Release Date : 2017-12-19
  • Genre: Technology & Engineering
  • Pages : 264
  • ISBN 10 : 9781351834797

SiGe and Si Strained Layer Epitaxy for Silicon Heterostructure Devices Excerpt :

What seems routine today was not always so. The field of Si-based heterostructures rests solidly on the shoulders of materials scientists and crystal growers, those purveyors of the semiconductor “black arts” associated with the deposition of pristine films of nanoscale dimensionality onto enormous Si wafers with near infinite precision. We can now grow near-defect free, nanoscale films of Si and SiGe strained-layer epitaxy compatible with conventional high-volume silicon integrated circuit manufacturing. SiGe and Si Strained-Layer Epitaxy for Silicon Heterostructure Devices tells the materials side of the story and details the many advances in the Si-SiGe strained-layer epitaxy for device applications. Drawn from the comprehensive and well-reviewed Silicon Heterostructure Handbook, this volume defines and details the many advances in the Si/SiGe strained-layer epitaxy for device applications. Mining the talents of an international panel of experts, the book covers modern SiGe epitaxial growth techniques, epi defects and dopant diffusion in thin films, stability constraints, and electronic properties of SiGe, strained Si, and Si-C alloys. It includes appendices on topics such as the properties of Si and Ge, the generalized Moll-Ross relations, integral charge-control relations, and sample SiGe HBT compact model parameters.

Silicon and Silicide Nanowires Book

Silicon and Silicide Nanowires

  • Author : Yu Huang
  • Publisher : CRC Press
  • Release Date : 2016-04-19
  • Genre: Technology & Engineering
  • Pages : 484
  • ISBN 10 : 9789814303477

Silicon and Silicide Nanowires Excerpt :

Nanoscale materials are showing great promise in various electronic, optoelectronic, and energy applications. Silicon (Si) has especially captured great attention as the leading material for microelectronic and nanoscale device applications. Recently, various silicides have garnered special attention for their pivotal role in Si device engineering and for the vast potential they possess in fields such as thermoelectricity and magnetism. The fundamental understanding of Si and silicide material processes at nanoscale plays a key role in achieving device structures and performance that meet real-world requirements and, therefore, demands investigation and exploration of nanoscale device applications. This book comprises the theoretical and experimental analysis of various properties of silicon nanocrystals, research methods and techniques to prepare them, and some of their promising applications.