CMOS Past  Present and Future Book

CMOS Past Present and Future


  • Author : Henry Radamson
  • Publisher : Woodhead Publishing
  • Release Date : 2018-04-03
  • Genre: Technology & Engineering
  • Pages : 278
  • ISBN 10 : 9780081021408

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CMOS Past Present and Future Excerpt :

CMOS Past, Present and Future provides insight from the basics, to the state-of-the-art of CMOS processing and electrical characterization, including the integration of Group IV semiconductors-based photonics. The book goes into the pitfalls and opportunities associated with the use of hetero-epitaxy on silicon with strain engineering and the integration of photonics and high-mobility channels on a silicon platform. It begins with the basic definitions and equations, but extends to present technologies and challenges, creating a roadmap on the origins of the technology and its evolution to the present, along with a vision for future trends. The book examines the challenges and opportunities that materials beyond silicon provide, including a close look at high-k materials and metal gate, strain engineering, channel material and mobility, and contacts. The book's key approach is on characterizations, device processing and electrical measurements. Addresses challenges and opportunities for the use of CMOS Covers the latest methods of strain engineering, materials integration to increase mobility, nano-scaled transistor processing, and integration of CMOS with photonic components Provides a look at the evolution of CMOS technology, including the origins of the technology, current status and future possibilities

Securitization  Past  Present and Future Book

Securitization Past Present and Future


  • Author : Solomon Y Deku
  • Publisher : Springer
  • Release Date : 2017-08-04
  • Genre: Business & Economics
  • Pages : 177
  • ISBN 10 : 9783319601281

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Securitization Past Present and Future Excerpt :

This book aims to explore if and how securitization changed financial intermediation and lending behaviour by reviewing the pre- and post-financial crisis theoretical and empirical literature. The book’s distinctive feature is bringing the growing post-crisis empirical evidence to the attention of a wider audience by critically appraising it against pre-crisis arguments. With its thought-provoking insights, this book is of particular interest for students, practitioners and academics.

SiGe  Ge  and Related Compounds 4  Materials  Processing  and Devices Book

SiGe Ge and Related Compounds 4 Materials Processing and Devices


  • Author : D. Harame
  • Publisher : The Electrochemical Society
  • Release Date : 2010-10
  • Genre: Germanium compounds
  • Pages : 1066
  • ISBN 10 : 9781566778251

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SiGe Ge and Related Compounds 4 Materials Processing and Devices Excerpt :

Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds has become a key component in the arsenal in improving semiconductor performance. This symposium discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.

FinFET Devices for VLSI Circuits and Systems Book

FinFET Devices for VLSI Circuits and Systems


  • Author : Samar K. Saha
  • Publisher : CRC Press
  • Release Date : 2020-07-15
  • Genre: Technology & Engineering
  • Pages : 318
  • ISBN 10 : 9780429998096

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FinFET Devices for VLSI Circuits and Systems Excerpt :

To surmount the continuous scaling challenges of MOSFET devices, FinFETs have emerged as the real alternative for use as the next generation device for IC fabrication technology. The objective of this book is to provide the basic theory and operating principles of FinFET devices and technology, an overview of FinFET device architecture and manufacturing processes, and detailed formulation of FinFET electrostatic and dynamic device characteristics for IC design and manufacturing. Thus, this book caters to practicing engineers transitioning to FinFET technology and prepares the next generation of device engineers and academic experts on mainstream device technology at the nanometer-nodes.

Photonics and Electronics with Germanium Book

Photonics and Electronics with Germanium


  • Author : Kazumi Wada
  • Publisher : John Wiley & Sons
  • Release Date : 2015-05-06
  • Genre: Science
  • Pages : 336
  • ISBN 10 : 9783527650224

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Photonics and Electronics with Germanium Excerpt :

Representing a further step towards enabling the convergence of computing and communication, this handbook and reference treats germanium electronics and optics on an equal footing. Renowned experts paint the big picture, combining both introductory material and the latest results. The first part of the book introduces readers to the fundamental properties of germanium, such as band offsets, impurities, defects and surface structures, which determine the performance of germanium-based devices in conjunction with conventional silicon technology. The second part covers methods of preparing and processing germanium structures, including chemical and physical vapor deposition, condensation approaches and chemical etching. The third and largest part gives a broad overview of the applications of integrated germanium technology: waveguides, photodetectors, modulators, ring resonators, transistors and, prominently, light-emitting devices. An invaluable one-stop resource for both researchers and developers.

Stress and Strain Engineering at Nanoscale in Semiconductor Devices Book

Stress and Strain Engineering at Nanoscale in Semiconductor Devices


  • Author : Chinmay K. Maiti
  • Publisher : CRC Press
  • Release Date : 2021-06-30
  • Genre: Science
  • Pages : 274
  • ISBN 10 : 9781000404937

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Stress and Strain Engineering at Nanoscale in Semiconductor Devices Excerpt :

Anticipating a limit to the continuous miniaturization (More-Moore), intense research efforts are being made to co-integrate various functionalities (More-than-Moore) in a single chip. Currently, strain engineering is the main technique used to enhance the performance of advanced semiconductor devices. Written from an engineering applications standpoint, this book encompasses broad areas of semiconductor devices involving the design, simulation, and analysis of Si, heterostructure silicongermanium (SiGe), and III-N compound semiconductor devices. The book provides the background and physical insight needed to understand the new and future developments in the technology CAD (TCAD) design at the nanoscale. Features Covers stressstrain engineering in semiconductor devices, such as FinFETs and III-V Nitride-based devices Includes comprehensive mobility model for strained substrates in global and local strain techniques and their implementation in device simulations Explains the development of strain/stress relationships and their effects on the band structures of strained substrates Uses design of experiments to find the optimum process conditions Illustrates the use of TCAD for modeling strain-engineered FinFETs for DC and AC performance predictions This book is for graduate students and researchers studying solid-state devices and materials, microelectronics, systems and controls, power electronics, nanomaterials, and electronic materials and devices.

On Wafer Microwave Measurements and De embedding Book

On Wafer Microwave Measurements and De embedding


  • Author : Errikos Lourandakis
  • Publisher : Artech House
  • Release Date : 2016-07-31
  • Genre: Technology & Engineering
  • Pages : 256
  • ISBN 10 : 9781630813710

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On Wafer Microwave Measurements and De embedding Excerpt :

This new authoritative resource presents the basics of network analyzer measurement equipment and troubleshooting errors involved in the on-wafer microwave measurement process. This book bridges the gap between theoretical and practical information using real-world practices that address all aspects of on-wafer passive device characterization in the microwave frequency range up to 60GHz. Readers find data and measurements from silicon integrated passive devices fabricated and tested in advance CMOS technologies. Basic circuit equations, terms and fundamentals of time and frequency domain analysis are covered. This book also explores the basics of vector network analyzers (VNA), two port S-parameter measurement routines, signal flow graphs, network theory, error models and VNA calibrations with the use of calibration standards.

Silicon Photonics Book

Silicon Photonics


  • Author : Graham T. Reed
  • Publisher : John Wiley & Sons
  • Release Date : 2008-05-23
  • Genre: Technology & Engineering
  • Pages : 354
  • ISBN 10 : 9780470994528

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Silicon Photonics Excerpt :

Silicon photonics is currently a very active and progressive area of research, as silicon optical circuits have emerged as the replacement technology for copper-based circuits in communication and broadband networks. The demand for ever improving communications and computing performance continues, and this in turn means that photonic circuits are finding ever increasing application areas. This text provides an important and timely overview of the ‘hot topics’ in the field, covering the various aspects of the technology that form the research area of silicon photonics. With contributions from some of the world’s leading researchers in silicon photonics, this book collates the latest advances in the technology. Silicon Photonics: the State of the Art opens with a highly informative foreword, and continues to feature: the integrated photonic circuit; silicon photonic waveguides; photonic bandgap waveguides; mechanisms for optical modulation in silicon; silicon based light sources; optical detection technologies for silicon photonics; passive silicon photonic devices; photonic and electronic integration approaches; applications in communications and sensors. Silicon Photonics: the State of the Art covers the essential elements of the entire field that is silicon photonics and is therefore an invaluable text for photonics engineers and professionals working in the fields of optical networks, optical communications, and semiconductor electronics. It is also an informative reference for graduate students studying for PhD in fibre optics, integrated optics, optical networking, microelectronics, or telecommunications.

Encyclopedia of Automotive Engineering Book
Score: 5
From 1 Ratings

Encyclopedia of Automotive Engineering


  • Author : David Crolla
  • Publisher : John Wiley & Sons
  • Release Date : 2015-03-23
  • Genre: Technology & Engineering
  • Pages : 3888
  • ISBN 10 : 9780470974025

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Encyclopedia of Automotive Engineering Excerpt :

A Choice Oustanding Academic Title The Encyclopedia of Automotive Engineering provides for the first time a large, unified knowledge base laying the foundation for advanced study and in-depth research. Through extensive cross-referencing and search functionality it provides a gateway to detailed but scattered information on best industry practice, engendering a better understanding of interrelated concepts and techniques that cut across specialized areas of engineering. Beyond traditional automotive subjects the Encyclopedia addresses green technologies, the shift from mechanics to electronics, and the means to produce safer, more efficient vehicles within varying economic restraints worldwide. The work comprises nine main parts: (1) Engines: Fundamentals (2) Engines: Design (3) Hybrid and Electric Powertrains (4) Transmission and Driveline (5) Chassis Systems (6) Electrical and Electronic Systems (7) Body Design (8) Materials and Manufacturing (9) Telematics. Offers authoritative coverage of the wide-ranging specialist topics encompassed by automotive engineering An accessible point of reference for entry level engineers and students who require an understanding of the fundamentals of technologies outside of their own expertise or training Provides invaluable guidance to more detailed texts and research findings in the technical literature Developed in conjunction with FISITA, the umbrella organisation for the national automotive societies in 37 countries around the world and representing more than 185,000 automotive engineers 6 Volumes www.automotive-reference.com An essential resource for libraries and information centres in industry, research and training organizations, professional societies, government departments, and all relevant engineering departments in the academic sector.

Fundamentals of Photonics Book

Fundamentals of Photonics


  • Author : Bahaa E. A. Saleh
  • Publisher : John Wiley & Sons
  • Release Date : 2019-02-27
  • Genre: Technology & Engineering
  • Pages : 1520
  • ISBN 10 : 9781118770092

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Fundamentals of Photonics Excerpt :

Fundamentals of Photonics A complete, thoroughly updated, full-color third edition Fundamentals of Photonics, Third Edition is a self-contained and up-to-date introductory-level textbook that thoroughly surveys this rapidly expanding area of engineering and applied physics. Featuring a blend of theory and applications, coverage includes detailed accounts of the primary theories of light, including ray optics, wave optics, electromagnetic optics, and photon optics, as well as the interaction of light and matter. Presented at increasing levels of complexity, preliminary sections build toward more advanced topics, such as Fourier optics and holography, photonic-crystal optics, guided-wave and fiber optics, LEDs and lasers, acousto-optic and electro-optic devices, nonlinear optical devices, ultrafast optics, optical interconnects and switches, and optical fiber communications. The third edition features an entirely new chapter on the optics of metals and plasmonic devices. Each chapter contains highlighted equations, exercises, problems, summaries, and selected reading lists. Examples of real systems are included to emphasize the concepts governing applications of current interest. Each of the twenty-four chapters of the second edition has been thoroughly updated.

Silicon Heterostructure Handbook Book

Silicon Heterostructure Handbook


  • Author : John D. Cressler
  • Publisher : CRC Press
  • Release Date : 2018-10-03
  • Genre: Technology & Engineering
  • Pages : 1248
  • ISBN 10 : 9781420026580

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Silicon Heterostructure Handbook Excerpt :

An extraordinary combination of material science, manufacturing processes, and innovative thinking spurred the development of SiGe heterojunction devices that offer a wide array of functions, unprecedented levels of performance, and low manufacturing costs. While there are many books on specific aspects of Si heterostructures, the Silicon Heterostructure Handbook: Materials, Fabrication, Devices, Circuits, and Applications of SiGe and Si Strained-Layer Epitaxy is the first book to bring all aspects together in a single source. Featuring broad, comprehensive, and in-depth discussion, this handbook distills the current state of the field in areas ranging from materials to fabrication, devices, CAD, circuits, and applications. The editor includes "snapshots" of the industrial state-of-the-art for devices and circuits, presenting a novel perspective for comparing the present status with future directions in the field. With each chapter contributed by expert authors from leading industrial and research institutions worldwide, the book is unequalled not only in breadth of scope, but also in depth of coverage, timeliness of results, and authority of references. It also includes a foreword by Dr. Bernard S. Meyerson, a pioneer in SiGe technology. Containing nearly 1000 figures along with valuable appendices, the Silicon Heterostructure Handbook authoritatively surveys materials, fabrication, device physics, transistor optimization, optoelectronics components, measurement, compact modeling, circuit design, and device simulation.

3D and Circuit Integration of MEMS Book

3D and Circuit Integration of MEMS


  • Author : Masayoshi Esashi
  • Publisher : John Wiley & Sons
  • Release Date : 2021-03-16
  • Genre: Technology & Engineering
  • Pages : 528
  • ISBN 10 : 9783527823253

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3D and Circuit Integration of MEMS Excerpt :

Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.

Advanced Flip Chip Packaging Book

Advanced Flip Chip Packaging


  • Author : Ho-Ming Tong
  • Publisher : Springer Science & Business Media
  • Release Date : 2013-03-20
  • Genre: Technology & Engineering
  • Pages : 560
  • ISBN 10 : 9781441957689

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Advanced Flip Chip Packaging Excerpt :

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Integration of 2D Materials for Electronics Applications Book

Integration of 2D Materials for Electronics Applications


  • Author : Filippo Giannazzo
  • Publisher : MDPI
  • Release Date : 2019-02-13
  • Genre: Chemistry
  • Pages : 265
  • ISBN 10 : 9783038976066

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Integration of 2D Materials for Electronics Applications Excerpt :

This book is a printed edition of the Special Issue "Integration of 2D Materials for Electronics Applications" that was published in Crystals

Computing Systems for Global Telecommunications Book

Computing Systems for Global Telecommunications


  • Author : S. West
  • Publisher : Springer Science & Business Media
  • Release Date : 1997-10-31
  • Genre: Technology & Engineering
  • Pages : 388
  • ISBN 10 : 0412825406

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Computing Systems for Global Telecommunications Excerpt :

Information systems for very large applications present problems of scale which generate the need for particular software design techniques. The system used by BT for its customer services is usable as a paradigm for any user operating with a large and complex client base. This book will cover some of the more important systems currently deployed by BT to manage its multi-million customer network, the architecture that guides these systems, the evolving technology from which they are built and the future directions in their evolution. Computing Systems for Global Telecommunications is essential reading for software engineers working on all types of large Operational Support Systems; systems designers working for telecommunications providers; advanced undergraduate and postgraduate students and researchers studying software engineering.