Electronic Enclosures  Housings and Packages Book

Electronic Enclosures Housings and Packages


  • Author : Frank Suli
  • Publisher : Woodhead Publishing
  • Release Date : 2018-11-15
  • Genre: Technology & Engineering
  • Pages : 490
  • ISBN 10 : 9780081023914

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Electronic Enclosures Housings and Packages Excerpt :

Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. Introduces the concepts of materials recycling and sustainability to electronic enclosures Provides thorough coverage of all technical aspects relating to the design and manufacturing of electronic packaging Includes practical information on environmental considerations, shielding, standardization, materials selection, and more

Practical Guide to the Packaging of Electronics  Second Edition Book

Practical Guide to the Packaging of Electronics Second Edition


  • Author : Ali Jamnia
  • Publisher : CRC Press
  • Release Date : 2008-11-20
  • Genre: Technology & Engineering
  • Pages : 336
  • ISBN 10 : 9781439870921

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Practical Guide to the Packaging of Electronics Second Edition Excerpt :

As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.

Advanced Rare Earth Based Ceramic Nanomaterials Book

Advanced Rare Earth Based Ceramic Nanomaterials


  • Author : Sahar Zinatloo-Ajabshir
  • Publisher : Elsevier
  • Release Date : 2022-01-15
  • Genre: Technology & Engineering
  • Pages : 412
  • ISBN 10 : 9780323899581

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Advanced Rare Earth Based Ceramic Nanomaterials Excerpt :

Advanced Rare Earth-Based Ceramic Nanomaterials focuses on recent advances related to preparation methods and applications of advanced rare earth-based ceramic nanomaterials. Different approaches for synthesizing rare earth-based ceramic nanomaterials are discussed, along with their advantages and disadvantages for applications in various fields. Sections cover rare earth-based ceramic nanomaterials like ceria and rare earth oxides (R2O3), rare earth vanadates, rare earth titanates, rare earth zirconates, rare earth stannates, rare earth-based tungstates, rare earth-based manganites, ferrites, cobaltites, nickelates, rare earth doped semiconductor nanomaterials, rare earth molybdates, rare earth-based nanocomposites, rare earth-based compounds for solar cells, and laser nanomaterials based on rare-earth compounds. Reviews the chemistry and processing of rare earth doped ceramic nanomaterials and their characteristics and applications Covers a broad range of materials, including ceria and rare earth oxides (R2O3), vanadates, titanates, zirconates, stannates, tungstates, manganites, ferrites, cobaltites, nickelates, rare earth doped semiconductor nanomaterials, rare earth molybdates, rare earth-based nanocomposites, rare earth-based compounds for solar cells, and laser nanomaterials based on rare-earth compounds Includes different approaches to synthesizing each family of rare earth-based ceramic nanomaterials, along with their advantages and disadvantages Provides green chemistry-based methods for the preparation of advanced rare earth-based ceramic nanomaterials

Handbook of Electronic Package Design Book

Handbook of Electronic Package Design


  • Author : Michael Pecht
  • Publisher : CRC Press
  • Release Date : 2018-10-24
  • Genre: Technology & Engineering
  • Pages : 904
  • ISBN 10 : 9781351838412

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Handbook of Electronic Package Design Excerpt :

Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

Electronic Packaging Materials and Their Properties Book

Electronic Packaging Materials and Their Properties


  • Author : Michael Pecht
  • Publisher : CRC Press
  • Release Date : 2017-12-19
  • Genre: Technology & Engineering
  • Pages : 112
  • ISBN 10 : 9781351830041

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Electronic Packaging Materials and Their Properties Excerpt :

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Designing Electronic Product Enclosures Book

Designing Electronic Product Enclosures


  • Author : Tony Serksnis
  • Publisher : Springer
  • Release Date : 2018-07-25
  • Genre: Technology & Engineering
  • Pages : 211
  • ISBN 10 : 9783319693958

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Designing Electronic Product Enclosures Excerpt :

This book explains the design and fabrication of any electronic enclosure that contains a printed circuit board, from original design through materials selection, building and testing, and ongoing design improvement. It presents a thorough and lucid treatment of material physical properties, engineering, and compliance considerations such that readers will understand concerns that exist with a design (structural, environmental, and regulatory) and what is needed to successfully enter the marketplace. To this end, a main thrust of this volume is on the “commercialization” of electronic products when an enclosure is needed. The book targets the broadest audience tasked with design and manufacture of an enclosure for an electronic product, from mechanical/industrial engineers to designers and technicians. Compiling a wealth of information on relevant physical phenomena (strength of materials, shock and vibration, heat transfer), the book stands as a ready reference on how and where these key properties may be considered in the design of most electronic enclosures.

Materials for Electronic Packaging Book
Score: 5
From 1 Ratings

Materials for Electronic Packaging


  • Author : Deborah Chung
  • Publisher : Elsevier
  • Release Date : 1995-03-31
  • Genre: Technology & Engineering
  • Pages : 368
  • ISBN 10 : 0080511171

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Materials for Electronic Packaging Excerpt :

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems

Handbook Of Electronics Packaging Design and Engineering Book

Handbook Of Electronics Packaging Design and Engineering


  • Author : Bernard S. Matisoff
  • Publisher : Springer Science & Business Media
  • Release Date : 2012-12-06
  • Genre: Science
  • Pages : 472
  • ISBN 10 : 9789401169790

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Handbook Of Electronics Packaging Design and Engineering Excerpt :

The Handbook of Electronics Packaging Design and Engineering has been writ ten as a reference source for use in the packaging design of electronics equip ment. It is designed to provide a single convenient source for the solution of re curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the following economies and equipment improvements: • Economics of design. Uniform design practices will result in less engineering and design times and lower costs. They will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. • Improved design. Better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. • Production economies. Uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. The Handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting profession. It attempts to present electronics packaging as it is today. It can be used as a training text for instructional purposes and as a reference source for the practicing designer and engineer.

Polymeric Materials for Electrostatic Applications Book

Polymeric Materials for Electrostatic Applications


  • Author : N. Drake
  • Publisher : iSmithers Rapra Publishing
  • Release Date : 1996
  • Genre: Elastomers
  • Pages : 174
  • ISBN 10 : 1859570763

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Polymeric Materials for Electrostatic Applications Excerpt :

This book describes the polymers, compounds, additives, fillers, and agents used to dissipate static and EMI. Techniques used to combat EMI are addressed. Sections of the report also cover legislation on electromagnetic compatibility.

Electronic Equipment Packaging Technology Book

Electronic Equipment Packaging Technology


  • Author : Gerald L. Ginsberg
  • Publisher : Springer Science & Business Media
  • Release Date : 2013-11-27
  • Genre: Science
  • Pages : 279
  • ISBN 10 : 9781461535423

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Electronic Equipment Packaging Technology Excerpt :

The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.

Handbook of Polymer Coatings for Electronics Book

Handbook of Polymer Coatings for Electronics


  • Author : James J. Licari
  • Publisher : William Andrew
  • Release Date : 1990-12-31
  • Genre: Science
  • Pages : 408
  • ISBN 10 : 9780815517689

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Handbook of Polymer Coatings for Electronics Excerpt :

This completely revised edition remains the only comprehensive treatise on polymer coatings for electronics. Since the original edition, the applications of coatings for the environmental protection of electronic systems have greatly increased, largely driven by the competitive need to reduce costs, weight and volume. The demands for high-speed circuits for the rapid processing of signals and data, high-density circuits for the storage and retrieval of megabits of memory, and the improved reliability required of electronics for guiding and controlling weapons and space vehicles have triggered the development of many new and improved coating polymers and formulations. Both the theoretical aspects of coatings (molecular structure of polymer types and their correlation with electrical and physical properties) and applied aspects (functions, deposition processes, applications, testing) are covered in the book. Over 100 proprietary coating formulations were reviewed, their properties collated, and tables of comparative properties prepared. This book is useful as both a primer and as a handbook for collecting properties data.

Handbook of Sealant Technology Book

Handbook of Sealant Technology


  • Author : K.L. Mittal
  • Publisher : CRC Press
  • Release Date : 2009-08-26
  • Genre: Science
  • Pages : 554
  • ISBN 10 : 9781420008630

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Handbook of Sealant Technology Excerpt :

Sealing is an age-old problem that dates back to our earliest attempts to create a more comfortable living environment. Prehistoric people used natural sealants such as earth, loam, grass, and reeds to protect the interior of their homes against the weather. Today's applications extend to a myriad of uses. The Handbook of Sealant Technology provide