ISTFA 2018  Proceedings from the 44th International Symposium for Testing and Failure Analysis Book

ISTFA 2018 Proceedings from the 44th International Symposium for Testing and Failure Analysis

  • Author : Anonim
  • Publisher : ASM International
  • Release Date : 2018-12-01
  • Genre: Uncategoriezed
  • Pages : null
  • ISBN 10 : 9781627080996

ISTFA 2018 Proceedings from the 44th International Symposium for Testing and Failure Analysis Excerpt :

The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.

ISTFA 2019  Proceedings of the 45th International Symposium for Testing and Failure Analysis Book

ISTFA 2019 Proceedings of the 45th International Symposium for Testing and Failure Analysis

  • Author : Anonim
  • Publisher : ASM International
  • Release Date : 2019-12-01
  • Genre: Technology & Engineering
  • Pages : 540
  • ISBN 10 : 9781627082730

ISTFA 2019 Proceedings of the 45th International Symposium for Testing and Failure Analysis Excerpt :

The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

Microelectronics Fialure Analysis Desk Reference  Seventh Edition Book

Microelectronics Fialure Analysis Desk Reference Seventh Edition

  • Author : Tejinder Gandhi
  • Publisher : ASM International
  • Release Date : 2019-11-01
  • Genre: Technology & Engineering
  • Pages : 750
  • ISBN 10 : 9781627082464

Microelectronics Fialure Analysis Desk Reference Seventh Edition Excerpt :

The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.

3D Microelectronic Packaging Book

3D Microelectronic Packaging

  • Author : Yan Li
  • Publisher : Springer Nature
  • Release Date : 2020-11-23
  • Genre: Technology & Engineering
  • Pages : 622
  • ISBN 10 : 9789811570902

3D Microelectronic Packaging Excerpt :

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

Emerging Topics in Hardware Security Book

Emerging Topics in Hardware Security

  • Author : Mark Tehranipoor
  • Publisher : Springer Nature
  • Release Date : 2021-04-30
  • Genre: Technology & Engineering
  • Pages : 602
  • ISBN 10 : 9783030644482

Emerging Topics in Hardware Security Excerpt :

This book provides an overview of emerging topics in the field of hardware security, such as artificial intelligence and quantum computing, and highlights how these technologies can be leveraged to secure hardware and assure electronics supply chains. The authors are experts in emerging technologies, traditional hardware design, and hardware security and trust. Readers will gain a comprehensive understanding of hardware security problems and how to overcome them through an efficient combination of conventional approaches and emerging technologies, enabling them to design secure, reliable, and trustworthy hardware.

Physical Assurance Book

Physical Assurance

  • Author : Navid Asadizanjani
  • Publisher : Springer Nature
  • Release Date : 2021-02-15
  • Genre: Technology & Engineering
  • Pages : 193
  • ISBN 10 : 9783030626099

Physical Assurance Excerpt :

This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.

Computer Vision for X Ray Testing Book

Computer Vision for X Ray Testing

  • Author : Domingo Mery
  • Publisher : Springer Nature
  • Release Date : 2020-12-21
  • Genre: Computers
  • Pages : 456
  • ISBN 10 : 9783030567699

Computer Vision for X Ray Testing Excerpt :

[FIRST EDITION] This accessible textbook presents an introduction to computer vision algorithms for industrially-relevant applications of X-ray testing. Features: introduces the mathematical background for monocular and multiple view geometry; describes the main techniques for image processing used in X-ray testing; presents a range of different representations for X-ray images, explaining how these enable new features to be extracted from the original image; examines a range of known X-ray image classifiers and classification strategies; discusses some basic concepts for the simulation of X-ray images and presents simple geometric and imaging models that can be used in the simulation; reviews a variety of applications for X-ray testing, from industrial inspection and baggage screening to the quality control of natural products; provides supporting material at an associated website, including a database of X-ray images and a Matlab toolbox for use with the book’s many examples.

Handbook of Materials Characterization Book

Handbook of Materials Characterization

  • Author : Surender Kumar Sharma
  • Publisher : Springer
  • Release Date : 2018-09-18
  • Genre: Technology & Engineering
  • Pages : 613
  • ISBN 10 : 9783319929552

Handbook of Materials Characterization Excerpt :

This book focuses on the widely used experimental techniques available for the structural, morphological, and spectroscopic characterization of materials. Recent developments in a wide range of experimental techniques and their application to the quantification of materials properties are an essential side of this book. Moreover, it provides concise but thorough coverage of the practical and theoretical aspects of the analytical techniques used to characterize a wide variety of functional nanomaterials. The book provides an overview of widely used characterization techniques for a broad audience: from beginners and graduate students, to advanced specialists in both academia and industry.

Materials for Advanced Packaging Book

Materials for Advanced Packaging

  • Author : Daniel Lu
  • Publisher : Springer
  • Release Date : 2016-11-18
  • Genre: Technology & Engineering
  • Pages : 969
  • ISBN 10 : 9783319450988

Materials for Advanced Packaging Excerpt :

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Wire Bonding in Microelectronics Book
Score: 1
From 1 Ratings

Wire Bonding in Microelectronics

  • Author : George Harman
  • Publisher : McGraw Hill Professional
  • Release Date : 2009-06-05
  • Genre: Technology & Engineering
  • Pages : 336
  • ISBN 10 : 9780071642651

Wire Bonding in Microelectronics Excerpt :

The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fifine-pitch, specialized-looping, soft-substrate, and extremetemperature wire bonds Copper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation CD includes all the book's full-color figures plus animations

Microelectronics Failure Analysis Book

Microelectronics Failure Analysis

  • Author : EDFAS Desk Reference Committee
  • Publisher : ASM International
  • Release Date : 2011
  • Genre: Technology & Engineering
  • Pages : 660
  • ISBN 10 : 9781615037261

Microelectronics Failure Analysis Excerpt :

Includes bibliographical references and index.

Metallography of Steels  Interpretation of Structure and the Effects of Processing Book

Metallography of Steels Interpretation of Structure and the Effects of Processing

  • Author : Hubertus Colpaert
  • Publisher : ASM International
  • Release Date : 2018-08-01
  • Genre: Technology & Engineering
  • Pages : null
  • ISBN 10 : 9781627081498

Metallography of Steels Interpretation of Structure and the Effects of Processing Excerpt :

Updated and translated by André Luiz V. da Costa e Silva This book is a combination of a metallographic atlas for steels and cast irons and an introductory textbook covering the fundamentals of phase transformations and heat treatment of these materials. Every important stage of processing, from casting to cold working is clearly discussed and copiously illustrated with metallographs that show the obtained structures, both desired and those achieved when deviations occur. First published in 1951 by Professor Hubertus Colpaert from the Institute for Technological Research (IPT) of São Paulo, Brazil, this book became one of the most important Brazilian references for professionals interested in the processing, treatment, and application of steels and cast irons. In the Fourth Edition and English translation, updated and translated by Professor André Luiz V. da Costa e Silva, the concept of the of the original edition was preserved while the important developments of recent decades, both in metallographic characterization and in steel and iron products, as well as progress in the understanding of the transformations that made the extraordinary developments of these alloys possible, were added. Most metallographs are of actual industrial materials and a large number originate from industry leaders or laboratories at the forefront of steel and iron development. As steel continues to be the most widely used metallic material in the world, Metallography of Steels continues to be an essential reference for students, metallographers, and engineers interested in understanding processing-properties-structure relationships of the material. The balance between theoretical and applied information makes this book a valuable companion for even experienced steel practitioners.

Scanning Nonlinear Dielectric Microscopy Book

Scanning Nonlinear Dielectric Microscopy

  • Author : Yasuo Cho
  • Publisher : Woodhead Publishing
  • Release Date : 2020-05-20
  • Genre: Technology & Engineering
  • Pages : 256
  • ISBN 10 : 9780081028032

Scanning Nonlinear Dielectric Microscopy Excerpt :

Scanning Nonlinear Dielectric Microscopy: Investigation of Ferroelectric, Dielectric, and Semiconductor Materials and Devices is the definitive reference on an important tool to characterize ferroelectric, dielectric and semiconductor materials. Written by the inventor, the book reviews the methods for applying the technique to key materials applications, including the measurement of ferroelectric materials at the atomic scale and the visualization and measurement of semiconductor materials and devices at a high level of sensitivity. Finally, the book reviews new insights this technique has given to material and device physics in ferroelectric and semiconductor materials. The book is appropriate for those involved in the development of ferroelectric, dielectric and semiconductor materials devices in academia and industry. Presents an in-depth look at the SNDM materials characterization technique by its inventor Reviews key materials applications, such as measurement of ferroelectric materials at the nanoscale and measurement of semiconductor materials and devices Analyzes key insights on semiconductor materials and device physics derived from the SNDM technique

Prognostics and Health Management of Electronics Book

Prognostics and Health Management of Electronics

  • Author : Michael G. Pecht
  • Publisher : John Wiley & Sons
  • Release Date : 2018-08-21
  • Genre: Technology & Engineering
  • Pages : 800
  • ISBN 10 : 9781119515357

Prognostics and Health Management of Electronics Excerpt :

An indispensable guide for engineers and data scientists in design, testing, operation, manufacturing, and maintenance A road map to the current challenges and available opportunities for the research and development of Prognostics and Health Management (PHM), this important work covers all areas of electronics and explains how to: assess methods for damage estimation of components and systems due to field loading conditions assess the cost and benefits of prognostic implementations develop novel methods for in situ monitoring of products and systems in actual life-cycle conditions enable condition-based (predictive) maintenance increase system availability through an extension of maintenance cycles and/or timely repair actions; obtain knowledge of load history for future design, qualification, and root cause analysis reduce the occurrence of no fault found (NFF) subtract life-cycle costs of equipment from reduction in inspection costs, downtime, and inventory Prognostics and Health Management of Electronics also explains how to understand statistical techniques and machine learning methods used for diagnostics and prognostics. Using this valuable resource, electrical engineers, data scientists, and design engineers will be able to fully grasp the synergy between IoT, machine learning, and risk assessment.

Introduction to Focused Ion Beams Book

Introduction to Focused Ion Beams

  • Author : Lucille A. Giannuzzi
  • Publisher : Springer Science & Business Media
  • Release Date : 2006-05-18
  • Genre: Science
  • Pages : 357
  • ISBN 10 : 9780387233130

Introduction to Focused Ion Beams Excerpt :

Introduction to Focused Ion Beams is geared towards techniques and applications. This is the only text that discusses and presents the theory directly related to applications and the only one that discusses the vast applications and techniques used in FIBs and dual platform instruments.