Reflow Soldering Processes Book

Reflow Soldering Processes

  • Author : Ning-Cheng Lee
  • Publisher : Newnes
  • Release Date : 2002-01-11
  • Genre: Technology & Engineering
  • Pages : 282
  • ISBN 10 : 9780750672184

Reflow Soldering Processes Excerpt :

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Reflow Soldering Book

Reflow Soldering

  • Author : Balázs Illés
  • Publisher : Elsevier
  • Release Date : 2020-07-02
  • Genre: Technology & Engineering
  • Pages : 294
  • ISBN 10 : 9780128185063

Reflow Soldering Excerpt :

Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries. Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles Analyses and compares the different reflow ovens Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality Introduces Vapor Phase Soldering (VPS) technology

Soldering Processes and Equipment Book

Soldering Processes and Equipment

  • Author : Michael Pecht
  • Publisher : John Wiley & Sons
  • Release Date : 1993-08-30
  • Genre: Technology & Engineering
  • Pages : 316
  • ISBN 10 : 047159167X

Soldering Processes and Equipment Excerpt :

Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.

Soldering Handbook For Printed Circuits and Surface Mounting Book

Soldering Handbook For Printed Circuits and Surface Mounting

  • Author : Howard H. Manko
  • Publisher : Springer Science & Business Media
  • Release Date : 1995-10-31
  • Genre: Computers
  • Pages : 548
  • ISBN 10 : 0442012063

Soldering Handbook For Printed Circuits and Surface Mounting Excerpt :

Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.

Principles of Reliable Soldering Techniques Book

Principles of Reliable Soldering Techniques

  • Author : R. Sengupta
  • Publisher : New Age International
  • Release Date : 1997
  • Genre: Uncategoriezed
  • Pages : 122
  • ISBN 10 : 8122411096

Principles of Reliable Soldering Techniques Excerpt :

Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical Requirements Essential To Ensure Its Reliability. The Four M'S; Material, Machine, Method And Man, Necessary For Designing A Solder Joint Have Been Described In Detail. Further, Process Control, Solder Joint Inspection Criteria, Solder Joint Defect Analysis And Its Repair/Rework Are Also Discussed.Additionally, Brief Introductions To Surface Mount Devices (Smd) And Surface Mount Technology (Smt) Have Been Included A Annexures. The Book Will Be Useful In Industry, And To Design Production, Process Planning And Quality Control Engineers, As Well As In Engineering/Technical Colleges To Students As A Reference Book For The Present And, Hopefully, Future Modified Courses. The Academicians May Find This Book Useful For Redesigning The Present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. And M.E. / M.Tech (Electrical, Electronic, Instrumentation) Syllabus.

Lead Free Soldering Book
Score: 1
From 1 Ratings

Lead Free Soldering

  • Author : Jasbir Bath
  • Publisher : Springer Science & Business Media
  • Release Date : 2007-06-26
  • Genre: Technology & Engineering
  • Pages : 299
  • ISBN 10 : 9780387684222

Lead Free Soldering Excerpt :

The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.

Mechanics of Solder Alloy Interconnects Book
Score: 1
From 1 Ratings

Mechanics of Solder Alloy Interconnects

  • Author : Darrel R. Frear
  • Publisher : Springer Science & Business Media
  • Release Date : 1994-01-31
  • Genre: Computers
  • Pages : 434
  • ISBN 10 : 0442015054

Mechanics of Solder Alloy Interconnects Excerpt :

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Brazing and Soldering 2012 Book

Brazing and Soldering 2012

  • Author : Robbin Gourley
  • Publisher : ASM International
  • Release Date : 2012
  • Genre: Brazing
  • Pages : 516
  • ISBN 10 : 9781615039937

Brazing and Soldering 2012 Excerpt :

Handbook of Industrial Engineering Book
Score: 4
From 5 Ratings

Handbook of Industrial Engineering

  • Author : Gavriel Salvendy
  • Publisher : John Wiley & Sons
  • Release Date : 2001-05-25
  • Genre: Technology & Engineering
  • Pages : 2846
  • ISBN 10 : 0471330574

Handbook of Industrial Engineering Excerpt :

Unrivaled coverage of a broad spectrum of industrial engineering concepts and applications The Handbook of Industrial Engineering, Third Edition contains a vast array of timely and useful methodologies for achieving increased productivity, quality, and competitiveness and improving the quality of working life in manufacturing and service industries. This astoundingly comprehensive resource also provides a cohesive structure to the discipline of industrial engineering with four major classifications: technology; performance improvement management; management, planning, and design control; and decision-making methods. Completely updated and expanded to reflect nearly a decade of important developments in the field, this Third Edition features a wealth of new information on project management, supply-chain management and logistics, and systems related to service industries. Other important features of this essential reference include: * More than 1,000 helpful tables, graphs, figures, and formulas * Step-by-step descriptions of hundreds of problem-solving methodologies * Hundreds of clear, easy-to-follow application examples * Contributions from 176 accomplished international professionals with diverse training and affiliations * More than 4,000 citations for further reading The Handbook of Industrial Engineering, Third Edition is an immensely useful one-stop resource for industrial engineers and technical support personnel in corporations of any size; continuous process and discrete part manufacturing industries; and all types of service industries, from healthcare to hospitality, from retailing to finance. Of related interest . . . HANDBOOK OF HUMAN FACTORS AND ERGONOMICS, Second Edition Edited by Gavriel Salvendy (0-471-11690-4) 2,165 pages 60 chapters "A comprehensive guide that contains practical knowledge and technical background on virtually all aspects of physical, cognitive, and social ergonomics. As such, it can be a valuable source of information for any ind

Surface Mount Technology Book

Surface Mount Technology

  • Author : Ray Prasad
  • Publisher : Springer Science & Business Media
  • Release Date : 2013-11-27
  • Genre: Technology & Engineering
  • Pages : 772
  • ISBN 10 : 9781461540847

Surface Mount Technology Excerpt :

A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.

Lead free Soldering Process Development and Reliability Book

Lead free Soldering Process Development and Reliability

  • Author : Jasbir Bath
  • Publisher : John Wiley & Sons
  • Release Date : 2020-06-12
  • Genre: Technology & Engineering
  • Pages : 512
  • ISBN 10 : 9781119482048

Lead free Soldering Process Development and Reliability Excerpt :

Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.

Springer Handbook of Mechanical Engineering Book
Score: 4
From 3 Ratings

Springer Handbook of Mechanical Engineering

  • Author : Grote Jark-Heinrich
  • Publisher : Springer Science & Business Media
  • Release Date : 2009-01-13
  • Genre: Science
  • Pages : 1589
  • ISBN 10 : 9783540491316

Springer Handbook of Mechanical Engineering Excerpt :

This resource covers all areas of interest for the practicing engineer as well as for the student at various levels and educational institutions. It features the work of authors from all over the world who have contributed their expertise and support the globally working engineer in finding a solution for today‘s mechanical engineering problems. Each subject is discussed in detail and supported by numerous figures and tables.

Proceedings of the Eighth Asia International Symposium on Mechatronics Book

Proceedings of the Eighth Asia International Symposium on Mechatronics

  • Author : Baoyan Duan
  • Publisher : Springer Nature
  • Release Date : 2022-07-29
  • Genre: Technology & Engineering
  • Pages : 2173
  • ISBN 10 : 9789811913099

Proceedings of the Eighth Asia International Symposium on Mechatronics Excerpt :

The book presents high-quality papers from the Eighth Asia International Symposium on Mechatronics (AISM 2021). It discusses the latest technological trends and advances in electromechanical coupling and environmental adaptability design of electronic equipment, sensing and measurement, mechatronics in manufacturing and automations, energy harvesting & storage, robotics, automation and control systems. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements, and testing. The applications and solutions discussed in the book provide excellent reference material for future product development.