Reliability and Failure of Electronic Materials and Devices Book

Reliability and Failure of Electronic Materials and Devices


  • Author : Milton Ohring
  • Publisher : Academic Press
  • Release Date : 2014-11-03
  • Genre: Technology & Engineering
  • Pages : 758
  • ISBN 10 : 9780080575520

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Reliability and Failure of Electronic Materials and Devices Excerpt :

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

Reliability and Failure of Electronic Materials and Devices Book

Reliability and Failure of Electronic Materials and Devices


  • Author : Milton Ohring
  • Publisher : Academic Press
  • Release Date : 2014
  • Genre: Technology & Engineering
  • Pages : 734
  • ISBN 10 : 0120885743

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Reliability and Failure of Electronic Materials and Devices Excerpt :

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

Semiconductor Material and Device Characterization Book

Semiconductor Material and Device Characterization


  • Author : Dieter K. Schroder
  • Publisher : John Wiley & Sons
  • Release Date : 2015-06-29
  • Genre: Technology & Engineering
  • Pages : 800
  • ISBN 10 : 9780471739067

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Semiconductor Material and Device Characterization Excerpt :

This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate

Reliability Assessments Book

Reliability Assessments


  • Author : Franklin Richard Nash, Ph.D.
  • Publisher : CRC Press
  • Release Date : 2017-07-12
  • Genre: Business & Economics
  • Pages : 749
  • ISBN 10 : 9781315353845

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Reliability Assessments Excerpt :

This book provides engineers and scientists with a single source introduction to the concepts, models, and case studies for making credible reliability assessments. It satisfies the need for thorough discussions of several fundamental subjects. Section I contains a comprehensive overview of assessing and assuring reliability that is followed by discussions of: • Concept of randomness and its relationship to chaos • Uses and limitations of the binomial and Poisson distributions • Relationship of the chi-square method and Poisson curves • Derivations and applications of the exponential, Weibull, and lognormal models • Examination of the human mortality bathtub curve as a template for components Section II introduces the case study modeling of failure data and is followed by analyses of: • 5 sets of ideal Weibull, lognormal, and normal failure data • 83 sets of actual (real) failure data The intent of the modeling was to find the best descriptions of the failures using statistical life models, principally the Weibull, lognormal, and normal models, for characterizing the failure probability distributions of the times-, cycles-, and miles-to-failure during laboratory or field testing. The statistical model providing the preferred characterization was determined empirically by choosing the two-parameter model that gave the best straight-line fit in the failure probability plots using a combination of visual inspection and three statistical goodness-of-fit (GoF) tests. This book offers practical insight in dealing with single item reliability and illustrates the use of reliability methods to solve industry problems.

Optical Waveguide Sensing and Imaging Book

Optical Waveguide Sensing and Imaging


  • Author : Wojtek J. Bock
  • Publisher : Springer Science & Business Media
  • Release Date : 2007-12-14
  • Genre: Science
  • Pages : 269
  • ISBN 10 : 9781402069529

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Optical Waveguide Sensing and Imaging Excerpt :

The book explores various aspects of existing and emerging fiber and waveguide optics sensing and imaging technologies including recent advances in nanobiophotonics. The focus is both on fundamental and applied research as well as on applications in civil engineering, biomedical sciences, environment, security and defence. The book aims to provide a reference of state-of-the-art overviews covering a variety of topics on the interface of engineering and biomedical sciences.

Electronic Materials Handbook Book
Score: 4.5
From 4 Ratings

Electronic Materials Handbook


  • Author : Anonim
  • Publisher : ASM International
  • Release Date : 1989-11-01
  • Genre: Technology & Engineering
  • Pages : 1234
  • ISBN 10 : 0871702851

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Electronic Materials Handbook Excerpt :

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Engineering Materials Science Book
Score: 4
From 3 Ratings

Engineering Materials Science


  • Author : Milton Ohring
  • Publisher : Academic Press
  • Release Date : 1995
  • Genre: Materials.
  • Pages : 861
  • ISBN 10 : 9780125249959

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Engineering Materials Science Excerpt :

Milton Ohring's Engineering Materials Science integrates the scientific nature and modern applications of all classes of engineering materials. This comprehensive, introductory textbook will provide undergraduate engineering students with the fundamental background needed to understand the science of structure–property relationships, as well as address the engineering concerns of materials selection in design, processing materials into useful products, andhow material degrade and fail in service. Specific topics include: physical and electronic structure; thermodynamics and kinetics; processing; mechanical, electrical, magnetic, and optical properties; degradation; and failure and reliability. The book offers superior coverage of electrical, optical, and magnetic materials than competing text.The author has taught introductory courses in material science and engineering both in academia and industry (AT&T Bell Laboratories) and has also written the well-received book, The Material Science of Thin Films (Academic Press).

Handbook of Thin Film Deposition Book

Handbook of Thin Film Deposition


  • Author : Krishna Seshan
  • Publisher : William Andrew
  • Release Date : 2018-02-23
  • Genre: Technology & Engineering
  • Pages : 470
  • ISBN 10 : 9780128123126

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Handbook of Thin Film Deposition Excerpt :

Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries Features a new chapter discussing Gates Dielectrics

Yield of Electronic Materials and Devices Book

Yield of Electronic Materials and Devices


  • Author : National Research Council (U.S.). Ad Hoc Panel on Yield of Electronic Materials and Devices
  • Publisher : Unknown
  • Release Date : 1972
  • Genre: Semiconductors
  • Pages : 100
  • ISBN 10 : NAP:15550

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Yield of Electronic Materials and Devices Excerpt :

Reliability of Semiconductor Lasers and Optoelectronic Devices Book

Reliability of Semiconductor Lasers and Optoelectronic Devices


  • Author : Robert Herrick
  • Publisher : Woodhead Publishing
  • Release Date : 2021-03-06
  • Genre: Technology & Engineering
  • Pages : 334
  • ISBN 10 : 9780128192559

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Reliability of Semiconductor Lasers and Optoelectronic Devices Excerpt :

Reliability of Semiconductor Lasers and Optoelectronic Devices simplifies complex concepts of optoelectronics reliability with approachable introductory chapters and a focus on real-world applications. This book provides a brief look at the fundamentals of laser diodes, introduces reliability qualification, and then presents real-world case studies discussing the principles of reliability and what occurs when these rules are broken. Then this book comprehensively looks at optoelectronics devices and the defects that cause premature failure in them and how to control those defects. Key materials and devices are reviewed including silicon photonics, vertical-cavity surface-emitting lasers (VCSELs), InGaN LEDs and lasers, and AlGaN LEDs, covering the majority of optoelectronic devices that we use in our everyday lives, powering the Internet, telecommunication, solid-state lighting, illuminators, and many other applications. This book features contributions from experts in industry and academia working in these areas and includes numerous practical examples and case studies. This book is suitable for new entrants to the field of optoelectronics working in R&D. • Includes case studies and numerous examples showing best practices and common mistakes affecting optoelectronics reliability written by experts working in the industry • Features the first wide-ranging and comprehensive overview of fiber optics reliability engineering, covering all elements of the practice from building a reliability laboratory, qualifying new products, to improving reliability on mature products. • Provides a look at the reliability issues and failure mechanisms for silicon photonics, VCSELs, InGaN LEDs and lasers, AIGaN LEDs, and more.

Micro  and Opto Electronic Materials and Structures  Physics  Mechanics  Design  Reliability  Packaging Book

Micro and Opto Electronic Materials and Structures Physics Mechanics Design Reliability Packaging


  • Author : Ephraim Suhir
  • Publisher : Springer Science & Business Media
  • Release Date : 2007-05-26
  • Genre: Technology & Engineering
  • Pages : 1460
  • ISBN 10 : 9780387329895

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Micro and Opto Electronic Materials and Structures Physics Mechanics Design Reliability Packaging Excerpt :

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Thermal Power Plant Performance Analysis Book
Score: 5
From 1 Ratings

Thermal Power Plant Performance Analysis


  • Author : Gilberto Francisco Martha de Souza
  • Publisher : Springer Science & Business Media
  • Release Date : 2012-01-04
  • Genre: Business & Economics
  • Pages : 289
  • ISBN 10 : 9781447123088

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Thermal Power Plant Performance Analysis Excerpt :

This book presents reliability-based tools used to define performance of complex systems and introduces the basic concepts of reliability, maintainability and risk analysis aiming at their application as tools for power plant performance improvement.