Robust Design of Microelectronics Assemblies Against Mechanical Shock  Temperature and Moisture Book

Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture

  • Author : E-H Wong
  • Publisher : Woodhead Publishing
  • Release Date : 2015-05-23
  • Genre: Technology & Engineering
  • Pages : 482
  • ISBN 10 : 9780857099112

Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture Excerpt :

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study

Cyber Physical Systems  Design and Application for Industry 4 0 Book

Cyber Physical Systems Design and Application for Industry 4 0

  • Author : Alla G. Kravets
  • Publisher : Springer Nature
  • Release Date : 2021-03-25
  • Genre: Technology & Engineering
  • Pages : 452
  • ISBN 10 : 9783030660819

Cyber Physical Systems Design and Application for Industry 4 0 Excerpt :

This book consists of chapters dedicated to the questions of cyber-physical system design and its usage for the chemical industry and new material design. Also, the contribution of the book covers scientific research and their results for cyber-physical systems design and application in the energy domain and solutions regarding engineering education for cyber-physical systems design. The book offers unique content for researchers and practitioners who are looking for new knowledge and skills in the framework of Industry 4.0 solutions. The book also benefits researchers and practitioners in chemistry and new material design and manufacturing to understand how cyber-physical systems can be applied to increase efficiency and performance. The target audience of the book are practitioners, enterprises representatives, scientists, Ph.D. and master students who perform scientific research or applications of cyber-physical systems in the concept of Industry 4.0.

Solder Joint Reliability Book

Solder Joint Reliability

  • Author : John H. Lau
  • Publisher : Springer Science & Business Media
  • Release Date : 2013-11-27
  • Genre: Technology & Engineering
  • Pages : 631
  • ISBN 10 : 9781461539100

Solder Joint Reliability Excerpt :

Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

Advanced Materials for Thermal Management of Electronic Packaging Book

Advanced Materials for Thermal Management of Electronic Packaging

  • Author : Xingcun Colin Tong
  • Publisher : Springer Science & Business Media
  • Release Date : 2011-01-05
  • Genre: Technology & Engineering
  • Pages : 618
  • ISBN 10 : 9781441977595

Advanced Materials for Thermal Management of Electronic Packaging Excerpt :

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Semiconductor Packaging Book

Semiconductor Packaging

  • Author : Andrea Chen
  • Publisher : CRC Press
  • Release Date : 2016-04-19
  • Genre: Technology & Engineering
  • Pages : 216
  • ISBN 10 : 9781439862070

Semiconductor Packaging Excerpt :

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

Reflow Soldering Processes Book

Reflow Soldering Processes

  • Author : Ning-Cheng Lee
  • Publisher : Newnes
  • Release Date : 2002-01-11
  • Genre: Technology & Engineering
  • Pages : 282
  • ISBN 10 : 9780750672184

Reflow Soldering Processes Excerpt :

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Failure Analysis Book

Failure Analysis

  • Author : Marius Bazu
  • Publisher : John Wiley & Sons
  • Release Date : 2011-03-08
  • Genre: Technology & Engineering
  • Pages : 344
  • ISBN 10 : 1119990009

Failure Analysis Excerpt :

Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet co

High Temperature Electronics Book

High Temperature Electronics

  • Author : F. Patrick McCluskey
  • Publisher : CRC Press
  • Release Date : 2018-05-04
  • Genre: Technology & Engineering
  • Pages : 279
  • ISBN 10 : 9781351440806

High Temperature Electronics Excerpt :

The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.

Materials and Processes Book

Materials and Processes

  • Author : Barrie D. Dunn
  • Publisher : Springer
  • Release Date : 2015-12-29
  • Genre: Technology & Engineering
  • Pages : 667
  • ISBN 10 : 9783319233628

Materials and Processes Excerpt :

The objective of this book is to assist scientists and engineers select the ideal material or manufacturing process for particular applications; these could cover a wide range of fields, from light-weight structures to electronic hardware. The book will help in problem solving as it also presents more than 100 case studies and failure investigations from the space sector that can, by analogy, be applied to other industries. Difficult-to-find material data is included for reference. The sciences of metallic (primarily) and organic materials presented throughout the book demonstrate how they can be applied as an integral part of spacecraft product assurance schemes, which involve quality, material and processes evaluations, and the selection of mechanical and component parts. In this successor edition, which has been revised and updated, engineering problems associated with critical spacecraft hardware and the space environment are highlighted by over 500 illustrations including micrographs and fractographs. Space hardware captured by astronauts and returned to Earth from long durations in space are examined. Information detailed in the Handbook is applicable to general terrestrial applications including consumer electronics as well as high reliability systems associated with aeronautics, medical equipment and ground transportation. This Handbook is also directed to those involved in maximizing the relia bility of new materials and processes for space technology and space engineering. It will be invaluable to engineers concerned with the construction of advanced structures or mechanical and electronic sub-systems.

Photovoltaic Module Reliability Book

Photovoltaic Module Reliability

  • Author : John H. Wohlgemuth
  • Publisher : John Wiley & Sons
  • Release Date : 2020-01-08
  • Genre: Science
  • Pages : 264
  • ISBN 10 : 9781119458968

Photovoltaic Module Reliability Excerpt :

Provides practical guidance on the latest quality assurance and accelerated stress test methods for improved long-term performance prediction of PV modules This book has been written from a historical perspective to guide readers through how the PV industry learned what the failure and degradation modes of PV modules were, how accelerated tests were developed to cause the same failures and degradations in the laboratory, and then how these tests were used as tools to guide the design and fabrication of reliable and long-life modules. Photovoltaic Module Reliability starts with a brief history of photovoltaics, discussing some of the different types of materials and devices used for commercial solar cells. It then goes on to offer chapters on: Module Failure Modes; Development of Accelerated Stress Tests; Qualification Testing; and Failure Analysis Tools. Next, it examines the use of quality management systems to manufacture PV modules. Subsequent chapters cover the PVQAT Effort; the Conformity Assessment and IECRE; and Predicting PV Module Service Life. The book finishes with a look at what the future holds for PV. A comprehensive treatment of current photovoltaic (PV) technology reliability and necessary improvement to become a significant part of the electric utility supply system Well documented with experimental and practical cases throughout, enhancing relevance to both scientific community and industry Timely contribution to the harmonization of methodological aspects of PV reliability evaluation with test procedures implemented to certify PV module quality Written by a leading international authority in PV module reliability Photovoltaic Module Reliability is an excellent book for anyone interested in PV module reliability, including those working directly on PV module and system reliability and preparing to purchase modules for deployment.

Mechanics of Microelectronics Book

Mechanics of Microelectronics

  • Author : G.Q. Zhang
  • Publisher : Springer Science & Business Media
  • Release Date : 2006-08-25
  • Genre: Technology & Engineering
  • Pages : 566
  • ISBN 10 : 9781402049354

Mechanics of Microelectronics Excerpt :

This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Materials for Advanced Packaging Book

Materials for Advanced Packaging

  • Author : Daniel Lu
  • Publisher : Springer
  • Release Date : 2016-11-18
  • Genre: Technology & Engineering
  • Pages : 969
  • ISBN 10 : 9783319450988

Materials for Advanced Packaging Excerpt :

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Plastics Materials and Processes Book
Score: 4
From 3 Ratings

Plastics Materials and Processes

  • Author : Charles A. Harper
  • Publisher : John Wiley & Sons
  • Release Date : 2003-10-10
  • Genre: Technology & Engineering
  • Pages : 1008
  • ISBN 10 : 9780471459200

Plastics Materials and Processes Excerpt :

Plastics Materials and Processes: A Concise Encyclopedia is a resource for anyone with an interest in plastic materials and processes, from seasoned professionals to laypeople. Arranged in alphabetical order, it clearly explains all of the materials and processes as well as their major application areas and usages. Plastics Materials and Processes: A Concise Encyclopedia: Discusses and describes applications and practical uses of the materials and processes. Clear definitions and sufficient depth to satisfy the information seekers needs