Three dimensional Integrated Circuit Design Book

Three dimensional Integrated Circuit Design


  • Author : Vasilis F. Pavlidis
  • Publisher : Morgan Kaufmann
  • Release Date : 2010-07-28
  • Genre: Technology & Engineering
  • Pages : 336
  • ISBN 10 : 0080921868

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Three dimensional Integrated Circuit Design Excerpt :

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits. * Demonstrates how to overcome "interconnect bottleneck" with 3-D integrated circuit design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers * The FIRST book on 3-D integrated circuit design...provides up-to-date information that is otherwise difficult to find * Focuses on design issues key to the product development cycle...good design plays a major role in exploiting the implementation flexibilities offered in the 3-D * Provides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization...offers practical view of designing 3-D circuits

Three Dimensional Integrated Circuit Design Book
Score: 5
From 1 Ratings

Three Dimensional Integrated Circuit Design


  • Author : Vasilis F. Pavlidis
  • Publisher : Newnes
  • Release Date : 2017-07-04
  • Genre: Technology & Engineering
  • Pages : 768
  • ISBN 10 : 9780124104846

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Three Dimensional Integrated Circuit Design Excerpt :

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

Three Dimensional Integrated Circuit Design Book

Three Dimensional Integrated Circuit Design


  • Author : Yuan Xie
  • Publisher : Springer Science & Business Media
  • Release Date : 2009-12-02
  • Genre: Technology & Engineering
  • Pages : 284
  • ISBN 10 : 9781441907844

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Three Dimensional Integrated Circuit Design Excerpt :

We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

Three Dimensional System Integration Book
Score: 5
From 1 Ratings

Three Dimensional System Integration


  • Author : Antonis Papanikolaou
  • Publisher : Springer Science & Business Media
  • Release Date : 2010-12-07
  • Genre: Architecture
  • Pages : 246
  • ISBN 10 : 9781441909626

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Three Dimensional System Integration Excerpt :

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

Three Dimensional Integrated Circuit Layout Book

Three Dimensional Integrated Circuit Layout


  • Author : A. C. Harter
  • Publisher : Cambridge University Press
  • Release Date : 1991-11-28
  • Genre: Computers
  • Pages : 241
  • ISBN 10 : 9780521416306

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Three Dimensional Integrated Circuit Layout Excerpt :

First published in 1991, this thesis concentrates upon the design of three-dimensional, rather than the traditional two-dimensional, circuits. The theory behind such circuits is presented in detail, together with experimental results.

3D Integration for NoC based SoC Architectures Book

3D Integration for NoC based SoC Architectures


  • Author : Abbas Sheibanyrad
  • Publisher : Springer Science & Business Media
  • Release Date : 2010-11-08
  • Genre: Technology & Engineering
  • Pages : 278
  • ISBN 10 : 9781441976185

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3D Integration for NoC based SoC Architectures Excerpt :

This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.

3D Integration in VLSI Circuits Book

3D Integration in VLSI Circuits


  • Author : Katsuyuki Sakuma
  • Publisher : CRC Press
  • Release Date : 2018-04-17
  • Genre: Technology & Engineering
  • Pages : 219
  • ISBN 10 : 9781351779821

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3D Integration in VLSI Circuits Excerpt :

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

Design of 3D Integrated Circuits and Systems Book

Design of 3D Integrated Circuits and Systems


  • Author : Rohit Sharma
  • Publisher : CRC Press
  • Release Date : 2018-09-03
  • Genre: Technology & Engineering
  • Pages : 328
  • ISBN 10 : 9781351831598

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Design of 3D Integrated Circuits and Systems Excerpt :

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Handbook of 3D Integration  Volume 4 Book

Handbook of 3D Integration Volume 4


  • Author : Paul D. Franzon
  • Publisher : John Wiley & Sons
  • Release Date : 2019-01-25
  • Genre: Technology & Engineering
  • Pages : 265
  • ISBN 10 : 9783527697045

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Handbook of 3D Integration Volume 4 Excerpt :

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Machine Vision for Three Dimensional Scenes Book

Machine Vision for Three Dimensional Scenes


  • Author : Herbert Freeman
  • Publisher : Elsevier
  • Release Date : 2012-12-02
  • Genre: Technology & Engineering
  • Pages : 432
  • ISBN 10 : 9780323150637

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Machine Vision for Three Dimensional Scenes Excerpt :

Machine Vision for Three-Dimensional Scenes contains the proceedings of the workshop "Machine Vision - Acquiring and Interpreting the 3D Scene" sponsored by the Center for Computer Aids for Industrial Productivity (CAIP) at Rutgers University and held in April 1989 in New Brunswick, New Jersey. The papers explore the applications of machine vision in image acquisition and 3D scene interpretation and cover topics such as segmentation of multi-sensor images; the placement of sensors to minimize occlusion; and the use of light striping to obtain range data. Comprised of 14 chapters, this book opens with a discussion on 3D object recognition and the problems that arise when dealing with large object databases, along with solutions to these problems. The reader is then introduced to the free-form surface matching problem and object recognition by constrained search. The following chapters address the problem of machine vision inspection, paying particular attention to the use of eye tracking to train a vision system; images of 3D scenes and the attendant problems of image understanding; the problem of object motion; and real-time range mapping. The final chapter assesses the relationship between the developing machine vision technology and the marketplace. This monograph will be of interest to practitioners in the fields of computer science and applied mathematics.

Wafer Level 3 D ICs Process Technology Book
Score: 5
From 1 Ratings

Wafer Level 3 D ICs Process Technology


  • Author : Chuan Seng Tan
  • Publisher : Springer Science & Business Media
  • Release Date : 2009-06-29
  • Genre: Technology & Engineering
  • Pages : 410
  • ISBN 10 : 9780387765341

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Wafer Level 3 D ICs Process Technology Excerpt :

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

Semiconductors Book

Semiconductors


  • Author : Artur Balasinski
  • Publisher : CRC Press
  • Release Date : 2018-09-03
  • Genre: Computers
  • Pages : 248
  • ISBN 10 : 9781439817155

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Semiconductors Excerpt :

Because of the continuous evolution of integrated circuit manufacturing (ICM) and design for manufacturability (DfM), most books on the subject are obsolete before they even go to press. That’s why the field requires a reference that takes the focus off of numbers and concentrates more on larger economic concepts than on technical details. Semiconductors: Integrated Circuit Design for Manufacturability covers the gradual evolution of integrated circuit design (ICD) as a basis to propose strategies for improving return-on-investment (ROI) for ICD in manufacturing. Where most books put the spotlight on detailed engineering enhancements and their implications for device functionality, in contrast, this one offers, among other things, crucial, valuable historical background and roadmapping, all illustrated with examples. Presents actual test cases that illustrate product challenges, examine possible solution strategies, and demonstrate how to select and implement the right one This book shows that DfM is a powerful generic engineering concept with potential extending beyond its usual application in automated layout enhancements centered on proximity correction and pattern density. This material explores the concept of ICD for production by breaking down its major steps: product definition, design, layout, and manufacturing. Averting extended discussion of technology, techniques, or specific device dimensions, the author also avoids the clumsy chapter architecture that can hinder other books on this subject. The result is an extremely functional, systematic presentation that simplifies existing approaches to DfM, outlining a clear set of criteria to help readers assess reliability, functionality, and yield. With careful consideration of the economic and technical trade-offs involved in ICD for manufacturing, this reference addresses techniques for physical, electrical, and logical design, keeping coverage fresh and concise for the designers, manufacturers, and research

3D IC Stacking Technology Book

3D IC Stacking Technology


  • Author : Banqiu Wu
  • Publisher : McGraw Hill Professional
  • Release Date : 2011-10-14
  • Genre: Technology & Engineering
  • Pages : 544
  • ISBN 10 : 9780071741965

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3D IC Stacking Technology Excerpt :

The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology

Integrated Circuit Design for Radiation Environments Book

Integrated Circuit Design for Radiation Environments


  • Author : Stephen J. Gaul
  • Publisher : John Wiley & Sons
  • Release Date : 2019-12-03
  • Genre: Technology & Engineering
  • Pages : 392
  • ISBN 10 : 9781118701874

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Integrated Circuit Design for Radiation Environments Excerpt :

A practical guide to the effects of radiation on semiconductor components of electronic systems, and techniques for the designing, laying out, and testing of hardened integrated circuits This book teaches the fundamentals of radiation environments and their effects on electronic components, as well as how to design, lay out, and test cost-effective hardened semiconductor chips not only for today’s space systems but for commercial terrestrial applications as well. It provides a historical perspective, the fundamental science of radiation, and the basics of semiconductors, as well as radiation-induced failure mechanisms in semiconductor chips. Integrated Circuits Design for Radiation Environments starts by introducing readers to semiconductors and radiation environments (including space, atmospheric, and terrestrial environments) followed by circuit design and layout. The book introduces radiation effects phenomena including single-event effects, total ionizing dose damage and displacement damage) and shows how technological solutions can address both phenomena. Describes the fundamentals of radiation environments and their effects on electronic components Teaches readers how to design, lay out and test cost-effective hardened semiconductor chips for space systems and commercial terrestrial applications Covers natural and man-made radiation environments, space systems and commercial terrestrial applications Provides up-to-date coverage of state-of-the-art of radiation hardening technology in one concise volume Includes questions and answers for the reader to test their knowledge Integrated Circuits Design for Radiation Environments will appeal to researchers and product developers in the semiconductor, space, and defense industries, as well as electronic engineers in the medical field. The book is also helpful for system, layout, process, device, reliability, applications, ESD, latchup and circuit design semiconductor engineers, along with anyone involved in micro-e

Fundamentals of Electromigration Aware Integrated Circuit Design Book
Score: 5
From 1 Ratings

Fundamentals of Electromigration Aware Integrated Circuit Design


  • Author : Jens Lienig
  • Publisher : Springer
  • Release Date : 2018-02-23
  • Genre: Technology & Engineering
  • Pages : 159
  • ISBN 10 : 9783319735580

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Fundamentals of Electromigration Aware Integrated Circuit Design Excerpt :

The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.