Wide Bandgap Power Semiconductor Packaging Book

Wide Bandgap Power Semiconductor Packaging


  • Author : Katsuaki Suganuma
  • Publisher : Woodhead Publishing
  • Release Date : 2018-06-13
  • Genre: Technology & Engineering
  • Pages : 240
  • ISBN 10 : 0081020945

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Wide Bandgap Power Semiconductor Packaging Excerpt :

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

Wide Bandgap Power Semiconductor Packaging Book

Wide Bandgap Power Semiconductor Packaging


  • Author : Katsuaki Suganuma
  • Publisher : Woodhead Publishing
  • Release Date : 2018-05-28
  • Genre: Technology & Engineering
  • Pages : 240
  • ISBN 10 : 9780081020951

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Wide Bandgap Power Semiconductor Packaging Excerpt :

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

Wide Bandgap Semiconductor Power Devices Book

Wide Bandgap Semiconductor Power Devices


  • Author : B. Jayant Baliga
  • Publisher : Woodhead Publishing
  • Release Date : 2018-10-17
  • Genre: Technology & Engineering
  • Pages : 418
  • ISBN 10 : 9780081023075

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Wide Bandgap Semiconductor Power Devices Excerpt :

Wide Bandgap Semiconductor Power Devices: Materials, Physics, Design and Applications provides readers with a single resource on why these devices are superior to existing silicon devices. The book lays the groundwork for an understanding of an array of applications and anticipated benefits in energy savings. Authored by the Founder of the Power Semiconductor Research Center at North Carolina State University (and creator of the IGBT device), Dr. B. Jayant Baliga is one of the highest regarded experts in the field. He thus leads this team who comprehensively review the materials, device physics, design considerations and relevant applications discussed. Comprehensively covers power electronic devices, including materials (both gallium nitride and silicon carbide), physics, design considerations, and the most promising applications Addresses the key challenges towards the realization of wide bandgap power electronic devices, including materials defects, performance and reliability Provides the benefits of wide bandgap semiconductors, including opportunities for cost reduction and social impact

Disruptive Wide Bandgap Semiconductors  Related Technologies  and Their Applications Book

Disruptive Wide Bandgap Semiconductors Related Technologies and Their Applications


  • Author : Yogesh Kumar Sharma
  • Publisher : BoD – Books on Demand
  • Release Date : 2018-09-12
  • Genre: Technology & Engineering
  • Pages : 154
  • ISBN 10 : 9781789236682

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Disruptive Wide Bandgap Semiconductors Related Technologies and Their Applications Excerpt :

SiC and GaN devices have been around for some time. The first dedicated international conference on SiC and related devices, "ICSCRM," was held in Washington, DC, in 1987. But only recently, the commercialization of SiC and GaN devices has happened. Due to its material properties, Si as a semiconductor has limitations in high-temperature, high-voltage, and high-frequency regimes. With the help of SiC and GaN devices, it is possible to realize more efficient power systems. Devices manufactured from SiC and GaN have already been impacting different areas with their ability to outperform Si devices. Some of the examples are the telecommunications, automotive/locomotive, power, and renewable energy industries. To achieve the carbon emission targets set by different countries, it is inevitable to use these new technologies. This book attempts to cover all the important facets related to wide bandgap semiconductor technology, including new challenges posed by it. This book is intended for graduate students, researchers, engineers, and technology experts who have been working in the exciting fields of SiC and GaN power devices.

Wafer Level Chip Scale Packaging Book

Wafer Level Chip Scale Packaging


  • Author : Shichun Qu
  • Publisher : Springer
  • Release Date : 2014-09-10
  • Genre: Technology & Engineering
  • Pages : 322
  • ISBN 10 : 9781493915569

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Wafer Level Chip Scale Packaging Excerpt :

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

Thermal and Electro thermal System Simulation 2020 Book

Thermal and Electro thermal System Simulation 2020


  • Author : Márta Rencz
  • Publisher : MDPI
  • Release Date : 2021-01-12
  • Genre: Technology & Engineering
  • Pages : 310
  • ISBN 10 : 9783039438310

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Thermal and Electro thermal System Simulation 2020 Excerpt :

This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.

Semiconductor Power Devices Book

Semiconductor Power Devices


  • Author : Josef Lutz
  • Publisher : Springer
  • Release Date : 2018-02-16
  • Genre: Technology & Engineering
  • Pages : 714
  • ISBN 10 : 9783319709178

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Semiconductor Power Devices Excerpt :

Halbleiter-Leistungsbauelemente sind das Kernstück der Leistungselektronik. Sie bestimmen die Leistungsfähigkeit und machen neuartige und verlustarme Schaltungen erst möglich. In dem Band wird neben den Halbleiter-Leistungsbauelementen selbst auch die Aufbau- und Verbindungstechnik behandelt: von den physikalischen Grundlagen und der Herstellungstechnologie über einzelne Bauelemente bis zu thermomechanischen Problemen, Zerstörungsmechanismen und Störungseffekten. Die 2., überarbeitete Auflage berücksichtigt technische Neuerungen und Entwicklungen.

Wide Bandgap Semiconductors for Power Electronics Book

Wide Bandgap Semiconductors for Power Electronics


  • Author : Peter Wellmann
  • Publisher : John Wiley & Sons
  • Release Date : 2022-01-10
  • Genre: Technology & Engineering
  • Pages : 743
  • ISBN 10 : 9783527346714

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Wide Bandgap Semiconductors for Power Electronics Excerpt :

Wide Bandgap Semiconductors for Power Electronic A guide to the field of wide bandgap semiconductor technology Wide Bandgap Semiconductors for Power Electronics is a comprehensive and authoritative guide to wide bandgap materials silicon carbide, gallium nitride, diamond and gallium(III) oxide. With contributions from an international panel of experts, the book offers detailed coverage of the growth of these materials, their characterization, and how they are used in a variety of power electronics devices such as transistors and diodes and in the areas of quantum information and hybrid electric vehicles. The book is filled with the most recent developments in the burgeoning field of wide bandgap semiconductor technology and includes information from cutting-edge semiconductor companies as well as material from leading universities and research institutions. By taking both scholarly and industrial perspectives, the book is designed to be a useful resource for scientists, academics, and corporate researchers and developers. This important book: Presents a review of wide bandgap materials and recent developments Links the high potential of wide bandgap semiconductors with the technological implementation capabilities Offers a unique combination of academic and industrial perspectives Meets the demand for a resource that addresses wide bandgap materials in a comprehensive manner Written for materials scientists, semiconductor physicists, electrical engineers, Wide Bandgap Semiconductors for Power Electronics provides a state of the art guide to the technology and application of SiC and related wide bandgap materials.

Electronic Enclosures  Housings and Packages Book

Electronic Enclosures Housings and Packages


  • Author : Frank Suli
  • Publisher : Woodhead Publishing
  • Release Date : 2018-11-15
  • Genre: Technology & Engineering
  • Pages : 490
  • ISBN 10 : 9780081023914

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Electronic Enclosures Housings and Packages Excerpt :

Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. Introduces the concepts of materials recycling and sustainability to electronic enclosures Provides thorough coverage of all technical aspects relating to the design and manufacturing of electronic packaging Includes practical information on environmental considerations, shielding, standardization, materials selection, and more

Die Attach Materials for High Temperature Applications in Microelectronics Packaging Book

Die Attach Materials for High Temperature Applications in Microelectronics Packaging


  • Author : Kim S. Siow
  • Publisher : Springer
  • Release Date : 2019-01-29
  • Genre: Technology & Engineering
  • Pages : 279
  • ISBN 10 : 9783319992563

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Die Attach Materials for High Temperature Applications in Microelectronics Packaging Excerpt :

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

Advances in Semiconductor Technologies Book

Advances in Semiconductor Technologies


  • Author : An Chen
  • Publisher : John Wiley & Sons
  • Release Date : 2022-09-27
  • Genre: Technology & Engineering
  • Pages : 372
  • ISBN 10 : 9781119869603

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Advances in Semiconductor Technologies Excerpt :

Advances in Semiconductor Technologies Discover the broad sweep of semiconductor technologies in this uniquely curated resource Semiconductor technologies and innovations have been the backbone of numerous different fields: electronics, online commerce, the information and communication industry, and the defense industry. For over fifty years, silicon technology and CMOS scaling have been the central focus and primary driver of innovation in the semiconductor industry. Traditional CMOS scaling has approached some fundamental limits, and as a result, the pace of scientific research and discovery for novel semiconductor technologies is increasing with a focus on novel materials, devices, designs, architectures, and computer paradigms. In particular, new computing paradigms and systems—such as quantum computing, artificial intelligence, and Internet of Things—have the potential to unlock unprecedented power and application space. Advances in Semiconductor Technologies provides a comprehensive overview of selected semiconductor technologies and the most up-to-date research topics, looking in particular at mainstream developments in current industry research and development, from emerging materials and devices, to new computing paradigms and applications. This full-coverage volume gives the reader valuable insights into state-of-the-art advances currently being fabricated, a wide range of novel applications currently under investigation, and a glance into the future with emerging technologies in development. Advances in Semiconductor Technologies readers will also find: A comprehensive approach that ensures a thorough understanding of state-of-the-art technologies currently being fabricated Treatments on all aspects of semiconductor technologies, including materials, devices, manufacturing, modeling, design, architecture, and applications Articles written by an impressive team of international academics and industry insiders that provide unique insights into a wide r

Wide Bandgap Based Devices Book

Wide Bandgap Based Devices


  • Author : Farid Medjdoub
  • Publisher : MDPI
  • Release Date : 2021-05-26
  • Genre: Technology & Engineering
  • Pages : 242
  • ISBN 10 : 9783036505664

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Wide Bandgap Based Devices Excerpt :

Emerging wide bandgap (WBG) semiconductors hold the potential to advance the global industry in the same way that, more than 50 years ago, the invention of the silicon (Si) chip enabled the modern computer era. SiC- and GaN-based devices are starting to become more commercially available. Smaller, faster, and more efficient than their counterpart Si-based components, these WBG devices also offer greater expected reliability in tougher operating conditions. Furthermore, in this frame, a new class of microelectronic-grade semiconducting materials that have an even larger bandgap than the previously established wide bandgap semiconductors, such as GaN and SiC, have been created, and are thus referred to as “ultra-wide bandgap” materials. These materials, which include AlGaN, AlN, diamond, Ga2O3, and BN, offer theoretically superior properties, including a higher critical breakdown field, higher temperature operation, and potentially higher radiation tolerance. These attributes, in turn, make it possible to use revolutionary new devices for extreme environments, such as high-efficiency power transistors, because of the improved Baliga figure of merit, ultra-high voltage pulsed power switches, high-efficiency UV-LEDs, and electronics. This Special Issue aims to collect high quality research papers, short communications, and review articles that focus on wide bandgap device design, fabrication, and advanced characterization. The Special Issue will also publish selected papers from the 43rd Workshop on Compound Semiconductor Devices and Integrated Circuits, held in France (WOCSDICE 2019), which brings together scientists and engineers working in the area of III–V, and other compound semiconductor devices and integrated circuits. In particular, the following topics are addressed: – GaN- and SiC-based devices for power and optoelectronic applications – Ga2O3 substrate development, and Ga2O3 thin film growth, doping, and devices – AlN-based emerging material and d

Practical Guide to Digital Manufacturing Book

Practical Guide to Digital Manufacturing


  • Author : Zhuming Bi
  • Publisher : Springer Nature
  • Release Date : 2021-05-24
  • Genre: Technology & Engineering
  • Pages : 424
  • ISBN 10 : 9783030703042

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Practical Guide to Digital Manufacturing Excerpt :

This book covers the subject of digital manufacturing. It provides a practical guide for readers on using computer aided design (CAD), computer aided engineering (CAE) and computer aided manufacturing (CAM) and other computer assistive tools for the design of products, machines, processes and system integrations through the case studies of engineering projects. The book introduces a thorough theoretical foundation and discussion of the historical development, and enabling technologies of digital manufacturing. It also covers a broad range of computer aided tools for a variety of applications including: geometric modelling; assembly modelling; motion simulation; finite element analysis; manufacturing process simulation; machining programming; product data management; and, product lifecycle management. Practical Guide to Digital Manufacturing uses many real-world case studies to illustrate the discussed applications, making it easily readable for undergraduate and graduate students, as well as engineers with the needs of computer-aided design and manufacturing knowledge and skills.

High Voltage Engineering and Applications Book

High Voltage Engineering and Applications


  • Author : Ayman El-Hag
  • Publisher : MDPI
  • Release Date : 2020-04-09
  • Genre: Technology & Engineering
  • Pages : 304
  • ISBN 10 : 9783039287161

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High Voltage Engineering and Applications Excerpt :

This book is a collection of recent publications from researchers all over the globe in the broad area of high-voltage engineering. The presented research papers cover both experimental and simulation studies, with a focus on topics related to insulation monitoring using state-of-the-art sensors and advanced machine learning algorithms. Special attention was given in the Special Issue to partial discharge monitoring as one of the most important techniques in insulation condition assessment. Moreover, this Special Issue contains several articles which focus on different modeling techniques that help researchers to better evaluate the condition of insulation systems. Different power system assets are addressed in this book, including transformers, outdoor insulators, underground cables, and gas-insulated substations.

Energy and Water Development Appropriations for 2016 Book

Energy and Water Development Appropriations for 2016


  • Author : United States. Congress. House. Committee on Appropriations. Subcommittee on Energy and Water Development
  • Publisher : Unknown
  • Release Date : 2015
  • Genre: Federal aid to energy development
  • Pages : 1740
  • ISBN 10 : STANFORD:36105050682363

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Energy and Water Development Appropriations for 2016 Excerpt :